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Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Applications and Research Progress of Aerogels in Fire-Resistant Coatings. [PDF]

open access: yesPolymers (Basel)
Yang H   +7 more
europepmc   +1 more source

Study of Shear Dominant Delamination in Thin Brittle-High Ductile Interface

open access: green, 2015
Md Shafiqul Islam   +3 more
openalex   +1 more source

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