Results 191 to 200 of about 326,768 (380)

Dynamic Bonds Reinforced Polyamide Elastomer for Biomedical Orthosis

open access: yesAdvanced Science, EarlyView.
A dynamic bonds (DBs) reinforced shape memory polyamide elastomer is developed using reactive extrusion. Dynamic covalent networks enhance interlayer adhesion in 4D‐printed objects by utilizing the combined effects of multiple DBs, reducing mechanical anisotropy and improving the mechanical and shape memory properties.
Zhen Li   +12 more
wiley   +1 more source

Stress tests on cylinders and aluminum panels [PDF]

open access: yes
An optimization study of composite stiffened cylinders is discussed. The mathematical model for the buckling has been coupled successfully with the optimization program AESOP.
Agarwal, B. L., Sobel, L. H.
core   +1 more source

Superelastic Fire‐Safe Aerogel with Hierarchical Structures via Dual Templates Aided by Microbubble Engineering

open access: yesAdvanced Science, EarlyView.
Here, a dual‐template strategy (ice and bubble template) is used to prepare fire‐safe aerogels with hierarchical structures. When the foam expansion ratio exceeds the jamming transition value in the foam system, the aerogels demonstrate superelasticity and extreme shape adaptability.
Xiaoyang Yu   +5 more
wiley   +1 more source

Soft and Stretchable Thienopyrroledione‐Based Polymers via Direct Arylation

open access: yesAdvanced Electronic Materials, EarlyView.
π‐conjugated polymers (CPs) that are concurrently soft and stretchable are needed for deformable electronics. This systematic molecular weight study on promising candidates for soft CPs, poly(indacenodithiophene‐co‐thienopyrroledione) (p(IDTC16‐TPDC8)) and poly(indacenodithienothiophene‐co‐thienopyrroledione) (p(IDTTC16‐TPDC8)) found that p(IDTC16 ...
Angela Lin   +9 more
wiley   +1 more source

Ecofriendly Printing of Silver Nanowires with Cellulose Binder for Highly Robust Flexible Electronics

open access: yesAdvanced Electronic Materials, EarlyView.
This work reports ecofriendly silver nanowire based ink with cellulose as the binder for printed flexible electronics. After annealing, the cellulose binder provides excellent adhesion between nanowires and substrate, leading to robust electromechanical performance of the printed electronics without encapsulation.
Yuxuan Liu   +5 more
wiley   +1 more source

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