Results 1 to 10 of about 214,038 (143)

Understanding the reminiscence bump: A systematic review

PLoS ONE, 2018
One of the most consistently observed phenomena in autobiographical memory research is the reminiscence bump: a tendency for middle-aged and elderly people to access more personal memories from approximately 10-30 years of age.
Khadeeja Munawar, Sara K Kuhn, Shamsul Haque   +2 more
exaly   +2 more sources

Investigating the Combined Effect of Multiple Dent and Bump Faults on the Vibrational Behavior of Ball Bearings

Machines, 2022
The rolling element bearing is a fundamental component of any rotating machinery. During operation, wear debris and lubricant impurities create dents and bumps on the bearing raceway surfaces.
Mahmoud M. Atef, Wael Khair-Eldeen, Jiwang Yan, Mohamed G. A. Nassef   +3 more
doaj   +1 more source

Novel Radiographic Measurements for Operatively Treated Haglund’s Deformity

Tomography, 2022
Background: Haglund’s deformity, which is characterized by a bony prominence of the posterosuperior aspect of the calcaneus, causes posterior heel pain.
Shih-Chieh Tang, Kao-Chang Tu, Wei-Jen Liao, Chang-Te Hsu, Han-Ting Shih, Kuan-Kai Tung, Min-Huan Wu, Shun-Ping Wang   +7 more
doaj   +1 more source

To the Calculation of the Average Value of the Volume Fraction of the Key Bulk Component at the Intermediate Stage of Mixing With an Inclined Bump

Frontiers in Energy Research, 2020
The aim of this work is to develop a stochastic method for calculating the average value of the volume fraction of a key bulk component at an intermediate stage of mixing with an inclined bump based on the energy method.
Anna Kapranova, Ivan Verloka, Daria Bahaeva, Mikhail Tarshis, Sergey Cherpitsky   +4 more
doaj   +1 more source

An experimental and simulation study on static tire enveloping stiffness

Mechanical Engineering Journal, 2020
Three bump sizes, six pressures and five placement angles of bump were used in this paper to conduct enveloping stiffness experiments. The experimental tire displacement-load curves showed that the enveloping stiffness of the tire under the same pressure
Chao-Zhi QIU, Peng-Fei SUN, Shui-Ting ZHOU, Hong-Wu HUANG, Meng DU   +4 more
doaj   +1 more source

A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials

Ain Shams Engineering Journal, 2022
Demand for more interconnection joints between semiconductor devices can be realized with solder bump technology. Surface tension and density are usually material properties related factors that affect solder bump geometric shape. Therefore, to cope with
Ab Aziz bin Mohd Yusof, Mohd Al Fatihhi Mohd Szali Januddi, Muhamad Noor Harun   +2 more
doaj   +1 more source

Numerical investigation of the effect of bump and indent inside a vertical tube on the subcooled flow boiling and critical heat flux

Journal of Mechanical Engineering and Sciences, 2020
One of the essential industry problems is the critical heat flux (CHF) phenomenon in the flow boiling regime which leads to the temperature jumping and damaging to the systems. Increasing the vapour volume fraction decreases the heat transfer coefficient,
Kianoush DolatiAsl , Ehsan Abedini , Younes Bakhshan   +2 more
doaj   +1 more source

Better Understanding of the Metamorphosis of Pregnancy (BUMP): protocol for a digital feasibility study in women from preconception to postpartum

npj Digital Medicine, 2022
The Better Understanding the Metamorphosis of Pregnancy (BUMP) study is a longitudinal feasibility study aimed to gain a deeper understanding of the pre-pregnancy and pregnancy symptom experience using digital tools.
S. M. Goodday, E. Karlin, A. Brooks, C. Chapman, D. R. Karlin, L. Foschini, E. Kipping, M. Wildman, M. Francis, H. Greenman, Li Li, E. Schadt, M. Ghassemi, A. Goldenberg, F. Cormack, N. Taptiklis, C. Centen, S. Smith, S. Friend   +18 more
doaj   +1 more source

Optimization of Bump Defect at High-Concentration In-Situ Phosphorus Doped Polysilicon/TEOS Oxide Interface for 3D NAND Flash Memory Application

IEEE Journal of the Electron Devices Society, 2021
In the 3D NAND Flash memory manufacturing process, high-concentration in-situ phosphorus-doped polysilicon and TEOS oxide stack will produce bump defects at the interfaces, causing pattern defects and electrical failures.
Dongxue Zhao, Zhiliang Xia, Linchun Wu, Tao Yang, Dongyu Fan, Yuancheng Yang, Lei Liu, Wenxi Zhou, Zongliang Huo   +8 more
doaj   +1 more source

PENDAMPINGAN PROGRAM KEMITRAAN PEMASARAN PRODUK HASIL PERIKANAN DI PONDOK PESANTREN SALAFIYAH SYAFI’IYAH SUKOREJO

As-Sidanah, 2019
: The assistance of fishery product marketing partnership program is intended as an effort for BUMP to utilize the market potential (offline market) of fishery products at the pondok pesantren Salafiyah Syafi'iyah Sukorejo and at the same time as an ...
Ramli Ramli
doaj   +1 more source