Results 231 to 240 of about 214,178 (294)
Conceptually mapping how investing in essential public health functions (EPHFs) and common goods for health (CGH) can improve health system performance. [PDF]
Front Public HealthAmri M +7 more
europepmc +1 more source
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Annals of the Institute of Statistical Mathematics, 1999
zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Fraiman, Ricardo, Meloche, Jean
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zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Fraiman, Ricardo, Meloche, Jean
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Proceedings of the 7th annual conference on Computer graphics and interactive techniques - SIGGRAPH '80, 1980
BUMPS (Brown University Multiple Projection System) is a program that illustrates the implementation of viewing transformations using animation. The program uses the viewing model defined in the Core Graphics System. BUMPS employs interactive computer graphics to demonstrate how planar geometric projections are generated, what the effects of different ...
Robert F. Gurwitz +3 more
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BUMPS (Brown University Multiple Projection System) is a program that illustrates the implementation of viewing transformations using animation. The program uses the viewing model defined in the Core Graphics System. BUMPS employs interactive computer graphics to demonstrate how planar geometric projections are generated, what the effects of different ...
Robert F. Gurwitz +3 more
openaire +1 more source
Proceedings of the 2015 British HCI Conference, 2015
This paper describes the development of a technology designed for social connectedness. The goal was to design and develop a technology that allows older adults to be more connected with family and/or close ones. Bridging Unmet Modes of Participation (BUMP) respond to the needs of designing technology products for inclusion and integration of older ...
Cody Chu, Claudia B. Rebola, James Kao
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This paper describes the development of a technology designed for social connectedness. The goal was to design and develop a technology that allows older adults to be more connected with family and/or close ones. Bridging Unmet Modes of Participation (BUMP) respond to the needs of designing technology products for inclusion and integration of older ...
Cody Chu, Claudia B. Rebola, James Kao
openaire +1 more source
Solder bump reliability-issues on bump layout
IEEE Transactions on Advanced Packaging, 2000The reliability of solder bumps in a typical under-filled flip chip package is calculated three-dimensionally (3-D) using the finite element method and a viscoplastic material model for the solder. Simulations are performed with varying bump placement, underfill coverage and board size.
E. Ristolainen, P. Heino, T. Alander
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Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration
Microelectronics Reliability, 2006Abstract This paper investigates the electromigration reliability of flip chip packages with and without pre-bump wafer probing via high temperature operation life test (HTOL) using printed and electroplated bumps. Under bump metallization (UBM) of printed and electroplated bumps is a thin film of Al/Ni(V)/Cu and Ti/Cu/Ni, respectively, while the ...
Kuo-Ming Chen, J.D. Wu, Kuo-Ning Chiang
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2012
Welcome to a fun chapter! In these pages you’ll build an interactive playground of clever little game design techniques that you can expand upon to build completely interactive two-dimensional environments, better known as action and adventure games!
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Welcome to a fun chapter! In these pages you’ll build an interactive playground of clever little game design techniques that you can expand upon to build completely interactive two-dimensional environments, better known as action and adventure games!
openaire +1 more source