Results 201 to 210 of about 9,936,892 (287)

Line Managers' Perspectives and Responses when Employees Burn Out. [PDF]

J Occup Rehabil
Claeys M, Van den Broeck A, Houkes I, de Rijk A.   +3 more
europepmc   +1 more source

A Multifunctional Ionograsper Enabling Ion‐Redistribution Proximity Sensing and Structural‐Reconfiguration‐Driven Bidirectional Actuation

Advanced Materials, EarlyView.
A solid‐state ionic actuator integrates sensing, actuation, and memory within one material. A brief UV pulse induces long‐lasting deformation via coupled network rearrangement, dehydration, and rehydration, while ionic redistribution enables self‐powered sensing, supporting multifunctional, energy‐efficient soft robotic functions without continuous ...
Yong Min Kim, Jin Han Kwon, Hyeon Woo Yang, Sungryong Kim, Gyeong Rok Lee, Hong Chul Moon   +5 more
wiley   +1 more source

Learning environment and its relationship with quality of life and burn-out among undergraduate medical students in Pakistan: a cross-sectional study. [PDF]

BMJ Open
Shahzad S, Wajid G.
europepmc   +1 more source

Spin Transport Across Interfaces With the Non‐Collinear Antiferromagnet Mn3Sn

Advanced Materials, EarlyView.
We study spin transport with Mn3Sn|Metal${\rm Mn}_3{\rm Sn}\vert{\rm Metal}$ heterostructures. For Mn3Sn|Pt${\rm Mn}_3{\rm Sn}\vert{\rm Pt}$ heterostructures, ultrafast spin current generation by optical pumping of Mn3Sn${\rm Mn}_3{\rm Sn}$ is explored, while for Mn3Sn|NiFe${\rm Mn}_3{\rm Sn}\vert{\rm NiFe}$ heterostructures, we probe the spin–charge ...
Paul A. Marschall, Wolfgang Hoppe, Prajwal Rigvedi, Börge Göbel, Franziska Ziolkowski, Samir Lounis, Banabir Pal, Stuart S. P. Parkin, Georg Woltersdorf   +8 more
wiley   +1 more source

Radiative Thermal Management for Extreme Environments: Mechanisms and Design Strategies

Advanced Materials, EarlyView.
In this review, we discuss the fundamental mechanisms of radiative cooling and solar heating, material and structural design strategies, hybrid approaches integrating additional heat transfer pathways, and durability‐oriented designs addressing environmental stresses.
Hyung Rae Kim, Haeseong Kim, Joo Hwan Ko, Gil Ju Lee, Dae‐Hyeong Kim, Young Min Song   +5 more
wiley   +1 more source

Soft and Transient Bioelectronics Enabled by Polymer‐Free Ti3C2Tx MXene Hydrogels

Advanced Materials, EarlyView.
We present Ti3C2Tx MXene hydrogel (MXgel) bioelectronics, a soft, flexible, and fully transient platform for high‐fidelity neural recording and stimulation. MXgel bioelectronics exhibit exceptional electrical conductivities, low electrochemical impedances, and high charge injection capacities.
Raghav Garg, Franco A. Laimo, Stefano Ippolito, Prastuti Upadhyay, Spencer R. Averbeck, Dimitris Boufidis, Charles‐Antoine Assenmacher, Dayo O. Adewole, Sai Panigrahy, Bita Soltan Mohammadlou, Lucy Plant, Yuan Zhang, Andrew G. Richardson, Yury Gogotsi, D. Kacy Cullen, Flavia Vitale   +15 more
wiley   +1 more source

Defect‐Driven Charge Separation in Ba‐Doped SrTiO3: Correlating Photoelectrochemical Performance With Dye‐Selective Photocatalysis

Advanced Materials Interfaces, EarlyView.
Ba‐doped SrTiO3 perovskites establish a direct correlation between photoelectrochemical activity and photocatalytic performance. Optimized Ba0.5Sr0.5TiO3 exhibits enhanced charge separation, photocurrent generation, and visible‐light‐driven dye degradation through defect‐induced oxygen vacancies and lattice distortion.
Sagar A. Nikam, Somnath Ladhane, Vikas P. Mhaske, Gotan H. Jain, Sandesh R. Jadkar, Shashikant P. Patole, Ganesh E. Patil   +6 more
wiley   +1 more source

Voorkom burn-out en PTSS. [PDF]

Zorgvisie, 2020
Kiers B.
europepmc   +1 more source

Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication

Advanced Materials Interfaces, EarlyView.
Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley   +1 more source