Results 201 to 210 of about 2,679,915 (389)
Molecular dynamics simulations are advancing the study of ribonucleic acid (RNA) and RNA‐conjugated molecules. These developments include improvements in force fields, long‐timescale dynamics, and coarse‐grained models, addressing limitations and refining methods.
Kanchan Yadav, Iksoo Jang, Jong Bum Lee
wiley +1 more source
Refractivity of lithium fluoride with application to the calibration of infrared spectrometers
L.W. Tilton, E. K. Plyler
openalex +1 more source
A Study on Thermal Expansion and Thermomechanical Behavior of Composite Metal Foams
The coefficient of thermal expansion of steel–steel composite metal foam (S‐S CMF) is shown to be lower than that of bulk stainless steel while its performance under compression demonstrate excellent mechanical stability and strength at all temperatures with gradualsoftening from 400 to 600 °C.
Zubin Chacko+2 more
wiley +1 more source
Controlling the size and distribution of dispersoids is essential for optimizing the performance of oxide‐dispersion‐strengthened steels. This study focuses on nanoparticle dispersion and agglomeration during laser additive manufacturing of Fe20Cr alloy reinforced with ZrO 2 nanoparticles. Utilizing multiphysics phase‐field simulations and nanoparticle
Somnath Bharech+6 more
wiley +1 more source
Impacts of Device Geometry and Layout on Temperature Profile during Large‐Area Photonic Curing
The study investigates how gate geometry affects peak curing temperature during photonic curing of solution‐processed indium zinc oxide thin‐film transistors. Using 3D simulations and experimental validation, it reveals that larger gate areas and smaller aspect ratios increase curing temperature and thus improve transistor performance. Findings provide
Yasir Fatha Abed+3 more
wiley +1 more source
Primary phases and a fatigue crack are studied in a forged blank of an aluminum alloy using synchrotron and laboratory X‐ray computed tomography. To image the crack, the fatigue test is interrupted, and a static tensile load is applied to open the crack.
Jakob Schröder+6 more
wiley +1 more source