Results 161 to 170 of about 244,565 (361)
Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration
Advanced Materials, EarlyView.A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa +9 more
wiley +1 more source
Advanced Materials, EarlyView.Self‐assembled amphiphilic phosphonate‐based supramolecule functions as a perovskite crystallization‐driven template at SnO2/perovskite buried interface, which induces a highly preferred (100) orientation toward out‐of‐plane direction, facilitates carrier extraction and transfer, passivates the intrinsic defects, and achieves a promising efficiency of ...
Zhenrong Wang +22 more
wiley +1 more source
Advanced Materials, EarlyView.A multi‐generational compositional design creates a printable low‐loss dielectric composite that achieves over 16 W m−1 K−1. This breakthrough is enabled by thermal post‐processing, which promotes templated crystallization in a polymer matrix from surface‐modified particles, creating a “hetero‐percolated network.” The resulting material is three ...
Daniel J. Braconnier +6 more
wiley +1 more source
Application of Low Temperature Calorimetry to Radioactive Measurements [PDF]
, 1935 F. Simon
openalex +1 more source
Liquid Metal‐Vitrimer Conductive Composite for Recyclable and Resilient Electronics
Advanced Materials, EarlyView.To address the growing electronic waste challenge, an electrically conductive, healable, and recyclable plastic composite is created, composed of vitrimer and liquid metal microdroplets. A reconfigurable circuit board is demonstrated using this composite material, providing a notable step toward sustainable and robust electronic technologies.
Dong Hae Ho +4 more
wiley +1 more source