Results 151 to 160 of about 97,530 (306)
Recent Advances of Slip Sensors for Smart Robotics
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang +8 more
wiley +1 more source
Capacitive Sensor Interface Circuits
This thesis focuses on simple capacitive measurement techniques suitable for integration in CMOS technologies. The main motivation being: to realize simple frontends for capacitive sensors and microsystems for integration in high-density sensing applications, for example, in arrays of sensors for highresolution ultrasound imaging.
openaire +1 more source
Smart Closed‐Loop Systems in Personalized Healthcare: Advances and Outlook
A smart closed‐loop e‐textile integrates multimodal sensing, onboard processing, wireless communication, and wearable power to enable real‐time physiological/biochemical monitoring and feedback‐controlled therapy. ABSTRACT Smart textiles represent a revolutionary frontier in healthcare, seamlessly blending fabric and advanced technologies to create ...
Safoora Khosravi +12 more
wiley +1 more source
Fabric‐Based Wearable Robotic Exoskeleton Gloves: Advancements and Challenges
This review highlights interdisciplinary technological advances in fabric‐based robotic gloves, focusing on progress in design, fabrication, actuation, sensing, control, and power and energy requirements. It also addresses performance testing and validation, including biomechanical, strength, functional, user experience, and durability assessments, to ...
Ayse Feyza Yilmaz +2 more
wiley +1 more source
Record Performance in Vertically Stacked, Solution‐Processed ZTO Schottky Diodes
Schottky diodes based on solution processed sustainable zinc—tin–oxide thin films present an eco‐friendly and versatile alternative to conventional CMOS based technologies. Beyond state‐of‐the‐art performance for vertically stacked solution‐based oxide diodes was achieved, including rectification ratios exceeding nine orders of magnitude, and intrinsic
Carlos Silva +10 more
wiley +1 more source
Enhanced Fringing Field Micro-Moisture Sensor with Elements Optimization. [PDF]
Meng X, Li C, Lan Y, Tan L, Zhang X.
europepmc +1 more source
Molecular Inks for the Development of Complex 3D In‐Mold Electronics
Molecular inks (MINKs) enable the fabrication of thermoformed 3D circuits by decoupling the forming and metallization steps. Following thermoforming, intense pulsed‑light or thermal processing converts the patterned MINKs into complex 3D conductive tracks with improved stretchability and electrical performance, advancing low‑cost, high‑performance in ...
Mehal P. Kushalkar +14 more
wiley +1 more source
Design and Implementation of a Low-Noise Analog Front-End Circuit for MEMS Capacitive Accelerometers. [PDF]
Gong K, Li J, Wang X, Cao H, Xie H.
europepmc +1 more source
In this study, we report a resistive‐type strain sensor fabricated using single‐walled CNTs, are used layer using the pray technique to deposit as conductive, and UV‐resin was spin‐coated as a protection layer. The sensor functioned in harsh temperature variation conditions from −50°C to 125°C without deterioration.
Jagan Singh Meena +4 more
wiley +1 more source
A capacitive-piezoelectric hybrid MEMS microphone with signal fusion for enhancing signal-to-noise ratio. [PDF]
Guan Y +10 more
europepmc +1 more source

