Results 181 to 190 of about 8,724 (249)

Synergistic Effect of Gradient Conductivity and Gradient Microstructures Enabled Ultrasensitive and Ultrabroad Linear Flexible Tactile Sensors

open access: yesAdvanced Science, EarlyView.
A design of double gradient effect is proposed to resolve the contradictory optimization on sensitivity and linearity of piezoresistive tactile sensors. The ultrawide linearity is realized by the sequential trigger of pressure‐induced gradient conductivity‐enabled linear current owing to the gradient microstructures.
Yao Fang   +13 more
wiley   +1 more source

Advances in silicon carbide pressure sensors for high-temperature extreme environment sensing. [PDF]

open access: yesMicrosyst Nanoeng
Wu C   +12 more
europepmc   +1 more source

Integrated Photoelectrode and Electrolyte Engineering via Carbon Quantum Dots for Self‐Powered H2O/O2‐Mediated Portable Photoelectrochemical Cells

open access: yesAdvanced Science, EarlyView.
Surface‐charged N‐CQDs serve as both electrolyte additives and photocathode modifiers. Electrodeposited N‐CQDs on Cu2O form a stable composite, steering 4e− ORR toward water. A quasi‐solid electrolyte with N‐CQDs aids charge migration, electrode‐electrolyte interfacial compatibility and replenishes active sites.
Yang Wu   +12 more
wiley   +1 more source

Critical point-based wireless sensors enabling tiny perturbation detection. [PDF]

open access: yesSci Adv
Ma C   +13 more
europepmc   +1 more source

Tunable flexible capacitive sensor for dynamic pressure monitoring. [PDF]

open access: yesMicrosyst Nanoeng
Fu H   +6 more
europepmc   +1 more source

A miniature magnetic switch unlocking multimodal, chip-free, and batteryless airway sensing. [PDF]

open access: yesSci Adv
Wang Y   +8 more
europepmc   +1 more source

Wearable Multifunctional Sensors for Human Activity Recognition. [PDF]

open access: yesSensors (Basel)
Zhang L   +7 more
europepmc   +1 more source
Some of the next articles are maybe not open access.

Related searches:

Single-Wafer Pressure Capacitive Sensor

2007 IEEE International Symposium on Circuits and Systems (ISCAS), 2007
A novel manufacturing process for pressure sensor without the need of wafer bonding is presented. Its main advantages are a simple fabrication process and an efficient integr ability with other devices. The sensor is composed of a polysilicon membrane that deflects due to the pressure difference applied over it.
R. G. Bolea   +2 more
openaire   +1 more source

Home - About - Disclaimer - Privacy