Results 41 to 50 of about 1,105,918 (250)

Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials

open access: yesAdvanced Engineering Materials, EarlyView.
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley   +1 more source

Copper Phthalocyanine Surface-type Photocapacitive Sensor

open access: yesEurasian Chemico-Technological Journal, 2007
In this study the photocapacitive behavior of organic semiconductor, photosensitive material copper phthalocyanine (CuPc) were investigated. Thin film of the copper phthalocyanine was deposited by vacuum evaporation on glass substrate with silver ...
Kh.S. Karimov   +5 more
doaj   +1 more source

A Novel Method for Detecting the Two-Degrees-of-Freedom Angular Displacement of a Spherical Pair, Based on a Capacitive Sensor

open access: yesSensors, 2022
The spherical pair has an important role in the inner frame of the stabilization mechanism of the aviation optoelectronic pod. However, its two-degrees-of-freedom (2-DOF) angular displacement signal is difficult to detect, seriously restricting its ...
Shengqi Yang   +7 more
doaj   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

open access: yesAdvanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw   +3 more
wiley   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

open access: yesAdvanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco   +8 more
wiley   +1 more source

Dual-Mode Stretchable Sensor Array with Integrated Capacitive and Mechanoluminescent Sensor Unit for Static and Dynamic Strain Mapping

open access: yesChemosensors, 2023
Electronic skin (e-skin) has the potential to detect large-scale strain, which is typically achieved by integrating multiple strain sensors into an array.
Song Wang   +9 more
doaj   +1 more source

Parasitic consideration for differential capacitive sensor [PDF]

open access: yes, 2019
Parasitic integration for a single supply differential capacitive sensing technique is presented in this paper. In real capacitive sensor measurement, parasitic impedance exists in its measurement.
Che Mustapha, Nurul Arfah   +10 more
core   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

open access: yesAdvanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova   +9 more
wiley   +1 more source

Biomass Native Structure Into Functional Carbon‐Based Catalysts for Fenton‐Like Reactions

open access: yesAdvanced Functional Materials, EarlyView.
This study indicates that eight biomasses with 2D flaky and 1D acicular structures influence surface O types, morphology, defects, N doping, sp2 C, and Co nanoparticles loading in three series of carbon, N‐doped carbon, and cobalt/graphitic carbon. This work identifies how these structural factors impact catalytic pathways, enhancing selective electron
Wenjie Tian   +7 more
wiley   +1 more source

Analysis and Correction of Measurement Error of Spherical Capacitive Sensor Caused by Assembly Error of the Inner Frame in the Aeronautical Optoelectronic Pod

open access: yesSensors, 2022
The ball joint is a multi-degree-of-freedom transmission pair, if it can replace the inner frame in the aviation photoelectric pod to carry the optical load, which will greatly simplify the system structure of the photoelectric pod and reduce the space ...
Tianxiang Ma   +5 more
doaj   +1 more source

Home - About - Disclaimer - Privacy