Results 191 to 200 of about 73,515 (299)

Highly conductive and stretchable nanostructured ionogels for 3D printing capacitive sensors with superior performance. [PDF]

Nat Commun
He X, Zhang B, Liu Q, Chen H, Cheng J, Jian B, Yin H, Li H, Duan K, Zhang J, Ge Q.   +10 more
europepmc   +1 more source

Fabric‐Based Wearable Robotic Exoskeleton Gloves: Advancements and Challenges

Advanced Materials Technologies, EarlyView.
This review highlights interdisciplinary technological advances in fabric‐based robotic gloves, focusing on progress in design, fabrication, actuation, sensing, control, and power and energy requirements. It also addresses performance testing and validation, including biomechanical, strength, functional, user experience, and durability assessments, to ...
Ayse Feyza Yilmaz, Gökhan Ince, Ozgur Atalay   +2 more
wiley   +1 more source

Comparative Analysis of Soil Moisture- and Weather-Based Irrigation Scheduling for Drip-Irrigated Lettuce Using Low-Cost Internet of Things Capacitive Sensors. [PDF]

Sensors (Basel)
Abdelmoneim AA, Al Kalaany CM, Dragonetti G, Derardja B, Khadra R.   +4 more
europepmc   +1 more source

Record Performance in Vertically Stacked, Solution‐Processed ZTO Schottky Diodes

Advanced Materials Technologies, EarlyView.
Schottky diodes based on solution processed sustainable zinc—tin–oxide thin films present an eco‐friendly and versatile alternative to conventional CMOS based technologies. Beyond state‐of‐the‐art performance for vertically stacked solution‐based oxide diodes was achieved, including rectification ratios exceeding nine orders of magnitude, and intrinsic
Carlos Silva, Asal Kiazadeh, Raquel Azevedo Martins, António Dias, Jorge Martins, Luís Mendes, João Vaz, Rodrigo Martins, Elvira Fortunato, Emanuel Carlos, Jonas Deuermeier   +10 more
wiley   +1 more source

Primate eye tracking with carbon-nanotube-paper-composite based capacitive sensors and machine learning algorithms. [PDF]

J Neurosci Methods
Li T, Sakthivelpathi V, Qian Z, Soetedjo R, Chung JH.   +4 more
europepmc   +1 more source

Molecular Inks for the Development of Complex 3D In‐Mold Electronics

Advanced Materials Technologies, EarlyView.
Molecular inks (MINKs) enable the fabrication of thermoformed 3D circuits by decoupling the forming and metallization steps. Following thermoforming, intense pulsed‑light or thermal processing converts the patterned MINKs into complex 3D conductive tracks with improved stretchability and electrical performance, advancing low‑cost, high‑performance in ...
Mehal P. Kushalkar, Hiroshi Fukutani, Olga Mozenson, Jianying Ouyang, Liliana Gaburici, Bhavana Deore, Dayna Bennett, Chantal Paquet, Paul Trudeau, Loleï Khoun, Nicolas Milliken, Olivier Ferrand, Julie Ferrigno, Xiangyang Liu, Arnold J. Kell   +14 more
wiley   +1 more source

Enabling High Strength and Toughness Polyurethane through Disordered-Hydrogen Bonds for Printable, Recyclable, Ultra-Fast Responsive Capacitive Sensors. [PDF]

Adv Sci (Weinh)
Chen X, Zhao S, Yuan A, Chen S, Liao Y, Lei Y, Fu X, Lei J, Jiang L.   +8 more
europepmc   +1 more source

Extreme‐Temperature Resistant, Flexible, and Sensitive Strain Sensor for Aerospace Parachute Deployment

Advanced Materials Technologies, EarlyView.
In this study, we report a resistive‐type strain sensor fabricated using single‐walled CNTs, are used layer using the pray technique to deposit as conductive, and UV‐resin was spin‐coated as a protection layer. The sensor functioned in harsh temperature variation conditions from −50°C to 125°C without deterioration.
Jagan Singh Meena, Lucas Lum Yu Xiang, Dhivya Dharshini Kannan, Chun Fei Siah, Yeow Kheng Lim   +4 more
wiley   +1 more source

Measurement System for Lossy Capacitive Sensors: Application to Edible Oils Quality Assessment. [PDF]

Sensors (Basel), 2019
Fendri A, Kallel AY, Nouri H, Ghariani H, Kanoun O.   +4 more
europepmc   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source