Results 161 to 170 of about 677,582 (318)

5,11‐Di(thiophen‐2‐yl)Tetracene: A Novel Tetracene Derivative for Efficient Singlet Fission with Enhanced Physical and Chemical Stability in Thin Films

open access: yesAdvanced Functional Materials, EarlyView.
In this work, a new tetracene derivative, 5,11‐di(thiophen‐2‐yl)tetracene (2T‐Tc) is introduced, exhibiting enhanced physical and chemical stability, and retaining favorable singlet fission kinetics with near unity triplet pair yield in thin films.
Jieun Lee   +11 more
wiley   +1 more source

Studies on Capsule Formation [PDF]

open access: bronze, 1940
J. C. Hoogerheide
openalex   +1 more source

Designing of Self‐Dispersing Soft Dendritic Microcleaners for Microplastics Capture and Recovery

open access: yesAdvanced Functional Materials, EarlyView.
The capture and recovery of microplastics from open aquatic systems is a complex problem, which necessitates nontrivial solutions. The principles of a comprehensive multistage process based on sustainably sourced microcleaners with hierarchical morphology are demonstrated.
Haeleen Hong   +3 more
wiley   +1 more source

Unique Performance Considerations for Printable Organic Semiconductor and Perovskite Radiation Detectors: Toward Consensus on Best Practice Evaluation

open access: yesAdvanced Functional Materials, EarlyView.
A lack of standard approaches for testing and reporting the performance of metal halide perovskites and organic semiconductor radiation detectors has resulted in inconsistent interpretation of performance parameters, impeding progress in the field. This Perspective recommends key metrics and experimental details, which are suggested for reporting in ...
Jessie A. Posar   +8 more
wiley   +1 more source

Carbon Nanotube 3D Integrated Circuits: From Design to Applications

open access: yesAdvanced Functional Materials, EarlyView.
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu   +3 more
wiley   +1 more source

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