Results 221 to 230 of about 175,016 (304)

Enhancing Grayscale E‐Beam Lithography: Thermal Treatment of Novolak‐Based Resist for 3D Nanostructures

open access: yesAdvanced Materials Interfaces, EarlyView.
Surface roughness and chemistry of novolak‐based grayscale resists are dependent on both exposure dose and post‐exposure thermal treatment. The observed trends align with the viscoelastic phase separation model and underscore the need to consider both thermodynamic and kinetic factors in resist processing. By tailoring thermal treatment, it is possible
Rahul Singh   +4 more
wiley   +1 more source

Low Resistance Interphase Formation at the PEO‐LiTFSI|LGPS Interface in Lithium Solid‐State Batteries

open access: yesAdvanced Materials Interfaces, EarlyView.
Interfacial charge transfer and low‐resistance interphase formation between PEO‐based polymer and Li10GeP2S12 solid electrolytes are investigated using multi‐electrode impedance spectroscopy and advanced analytical techniques such as XPS and ToF‐SIMS.
Ujjawal Sigar   +6 more
wiley   +1 more source

Self‐Assembled Cobalt Oxide Nanobeads on the Conducting Van der Waals Semi‐Metal PtTe2 for Catalytic Heterostructure

open access: yesAdvanced Materials Interfaces, EarlyView.
Self‐assembled CoO nanobeads on the Van der Waals surface of PtTe2 were synthesized through simple thermal annealing utilizing the residual oxygen in the annealing chamber. In this study, the electrocatalytic effect for oxygen evolution reaction from CoO nanobeads on conducting PtTe2 was confirmed, elucidating the new pathway to design a ...
Minhyuk Choi   +9 more
wiley   +1 more source

Fabrication Method of Directional Microstructure for High Energy Density, High Power Battery Cathodes

open access: yesAdvanced Materials Interfaces, EarlyView.
Aqueous directional ice templating (DIT) is developed for making NMC811 cathodes containing vertically aligned pore arrays through electrode thickness. The effects of calendering are studied for the DIT electrodes to find optimal calendering and simultaneously achieve high gravimetric and volumetric energy densities and rate capability for lithium ion ...
Guanting Li   +3 more
wiley   +1 more source

Fully Printed Organic Electrochemical Transistors With Low‐Resistance Electrodes on Planarized 3D‐Printed Substrates

open access: yesAdvanced Materials Technologies, EarlyView.
This paper explores integrating organic electrochemical transistors (OECTs) with planarized 3D‐printed substrates, utilizing ironing to enhance surface suitability for printing, dispense printing for thick, low‐resistance silver electrodes, and inkjet printing for semiconductor deposition.
Mohamad Kannan Idris   +3 more
wiley   +1 more source

Defect‐Healed Au/rGO Coating for the Corrosion Protection of PEMFC Bipolar Plates

open access: yesAdvanced Materials Technologies, EarlyView.
 A defect‐healed gold/reduced graphene oxide (Au/rGO) coating is presented for stainless steel bipolar plates in polymer electrolyte membrane fuel cells. Gold nanoparticles nucleate at graphene oxide defects, blocking corrosive ion penetration and enhancing corrosion resistance, thereby ensuring durable fuel cell operation.
Jinmyeong Seo   +6 more
wiley   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

open access: yesAdvanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya   +2 more
wiley   +1 more source

Site‐Selective Polyvinylpyrrolidone Adsorption Behavior for 3D Heterogeneous Integration

open access: yesAdvanced Materials Technologies, EarlyView.
Site‐selective adsorption behavior is presented with polyvinylpyrrolidone on a Cu/SiO2 pattern wafer, which enables 3D heterogeneous integration. Owing to the site‐selective adsorption behavior and its corresponding electrostatic interaction between SiO2 nanoparticles and the Cu surface, the selectivity of Cu/SiO2 is arbitrarily controlled ...
Hosin Hwang   +9 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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