Results 281 to 290 of about 442,192 (347)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Micromechanical simulations and analyses based on synchrotron 3D imaging for nodular cast iron tested under different stress states

open access: green, 2017
Thilo F. Morgeneyer   +7 more
openalex   +1 more source

Cast Iron

Canadian Theatre Review, 2005
Caution: Copyright Lisa Codrington. This script is protected under the copyright laws of Canada and all other countries of the Copyright Union. Changes to the script are forbidden without the written consent of the author. Rights to produce, film or record in any medium, in any language, by any group, are retained by the author. The moral right of the
openaire   +1 more source

Cast Irons

2007
Abstract This chapter discusses the composition, properties, microstructure, grain formation, and fracture behavior of gray, white, ductile, and malleable cast iron and how these critical factors are affected when iron is heated to different temperatures prior to or during solidification.
openaire   +1 more source

Cast Irons

2016
Cast ironshaveplayedanimportantroleinthedevelopmentofthehumanspecies.Theyhavebeenproducedinvarious compositions forthousandsofyears.Mostoftentheyhavebeenusedintheas-castformtosatisfystructuralandshape requirements. Themechanicalandphysicalpropertiesofcastironshavebeenenhancedthroughunderstandingofthefunda- mental relationshipsbetweenmicrostructure ...
Rundman, K. B., IACOVIELLO, Francesco
openaire   +2 more sources

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