Determinants of Health-Promoting Behaviors Among Indonesian Adolescents Living in Child Welfare Institutions: Cross-Sectional Survey Study. [PDF]
Ispriantari A +6 more
europepmc +1 more source
Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang +6 more
wiley +1 more source
Promoting Health Equity for Children With Special Health Care Needs and Child Welfare Involvement. [PDF]
Simard AA +7 more
europepmc +1 more source
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Role of Child Welfare in Detection and Treatment of Early Childhood Developmental Concerns.
Connell CM +3 more
europepmc +1 more source
The Influence of Child Welfare Involvement on Parent Engagement Among Immigrant Families Who Receive Home Visiting Services. [PDF]
Andom F +3 more
europepmc +1 more source
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
Strategies to Improve the Sexual and Reproductive Health of Youth Involved with the Child Welfare System: A Systematic Review. [PDF]
Brasileiro J +5 more
europepmc +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source

