Results 141 to 150 of about 639,557 (319)
Systematic Approach to Optimum Chip Pulse Shape Design
, 2008 In this work we establish a systematic approach to design optimum chip pulse shapes for DS-CDMA systems which are absolutely bandlimited, whose energy is mainly concentrated in one chip duration, and thatminimize the Cramer-Rao lower bound for the ...
Antreich, Felix +2 more
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Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
Advanced Engineering Materials, EarlyView.A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
Optimization of the Production of Rubber Compounds Using Mathematical Models
Advanced Engineering Materials, EarlyView.Rubber compounds were mixed in a batch internal mixer, and symbolic regression was used to derive mathematical models linking recipe and process parameters to ram path, torque, and mixing quality (incorporation, dispersion, distribution). Subsequent optimization with evolutionary algorithms identified operating conditions that reduce specific energy ...
Anke Bardehle +7 more
wiley +1 more source
Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures
Advanced Engineering Materials, EarlyView.We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann +2 more
wiley +1 more source
AC Coupled Interconnect for Inter-chip Communications
, 2007 The scaling of integrated circuit (IC) technology demands high-speed, high-density and low-power input/output (I⁄O) for inter-chip communications.
Xu, Jian
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Advanced Engineering Materials, EarlyView.Aluminum and nitride coatings are used in industry because they are hard, resist wear, and protect against oxidation. Adding boron can improve friction behavior and other properties. This study tests coatings on surfaces with different finishes. Results show smoother surfaces perform better, while rough ones wear faster, although coatings can reduce ...
Adrián Claver +9 more
wiley +1 more source
Numerical Study of Counterflow Microchannels with Non-Uniform Ribs
Zhileng xuebaoThe formation mechanism of high-temperature zones in counterflow microchannel heat sinks was investigated through computational fluid dynamics numerical simulations.
Wang Shouyuan Wang Zhiqiang
doaj
Advanced Engineering Materials, EarlyView.This review highlights advances in lightweight, lead‐free polymer nanocomposites for diagnostic X‐ray shielding. By linking filler chemistry, dispersion, architecture, and photon interaction mechanisms, it establishes structure–performance relationships guiding material design.
Aklilu G. Messele +2 more
wiley +1 more source
On-Chip Optical Interconnection Networks for Multi/Manycore Architectures
, 2012 The rapid development of multi/manycore technologies offers the opportunity for highly parallel architectures implemented on a single chip. While the first, low-parallelism multicore products have been based on simple interconnection structures (single ...
SABA, GIANMARCO
core