Performance Comparison of Surface Sensitizers for Diode Laser Powder Bed Fusion of Polyamide 12
Advanced Engineering Materials, EarlyView.Laser‐generated nanoparticles transform standard PA12 powders into high‐performance, dye‐free feedstocks for diode laser 3D printing. Despite identical absorbance at 808 nm, CuS, LaB6, and CB coatings reveal striking differences in fusion and strength—unlocking new design space for recyclable, industrial‐grade polymers.
Michael Willeke +9 more
wiley +1 more source
Incident cytopenia and risk of subsequent myeloid neoplasm in age-related clonal hematopoiesis: a multi-biobank case-control study. [PDF]
EClinicalMedicineBrogan J +11 more
europepmc +1 more source
Advanced Engineering Materials, EarlyView.This study explores combining two existing aerospace titanium alloy powders, processing them via field‐assisted sintering technology and the subsequent discovery of a novel alloy composition, termed S23, with ultra‐high tensile toughness. Fine‐scale alpha precipitates favorably form in the alloy despite the relatively slow cooling, providing an ...
Samuel Lister +2 more
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Clonal Hematopoiesis: Impact on Health and Disease. [PDF]
Hematol OncolCaiado F, Manz MG.
europepmc +1 more source
Discussion: “Chip Formation in High-Speed Cutting of Copper and Aluminum” (Trigger, K. J., and von Turkovich, B. F., 1963, ASME J. Eng. Ind., 85, pp. 365–372) [PDF]
, 1963 Alfred Schmidt
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State of the art in chip-to-chip interconnects
, 2021 Esta tesis presenta un estudio de enlaces de corto alcance para chips montados en un mismo paquete, en placas de circuito impreso o intercaladores. Implementado en tecnología CMOS entre 7 y 250 nm, con enlaces que operan a una velocidad de datos entre 0,4 y 112 Gb/s/pin y con eficiencias energéticas de 0,3 a 67,7 pJ/bit.
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Advanced Engineering Materials, EarlyView.The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
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Development of a Thiol-ene Microfluidic Chip for Hydrogen/Deuterium Exchange Mass Spectrometry (HDX-MS). [PDF]
Anal ChemHansen AB +8 more
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Discussion: “Use of Chip Tension to Obtain a Stress-Strain Curve From Metal Cutting Tests” (Finnie, I., and Wolak, J., 1963, ASME J. Eng. Ind., 85, pp. 351–355) [PDF]
, 1963 F. A. McClintock
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