Results 11 to 20 of about 1,488,806 (302)
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process
Proceedings, 2017 This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng +6 more
doaj +1 more source
Distance similarity measure based profiling attacks against masked chips
Electronics Letters, 2022 The attack price of higher order side channel attacks (HOSCA) grows exponentially with the mask order. When the mask order is larger than 3, HOSCA can be inapplicable.
Dejian Li +5 more
doaj +1 more source
The Write Stuff: U.S. Serial Print Culture from Conservatives out to Neo-Nazis [PDF]
, 2008 Insufficient scholarly attention has been devoted to alternative or "oppositional" serials from the political right, even though a number of scholars have used these materials as primary sources for studies in several academic disciplines.
Berlet, Chip
core +1 more source
Journal of Imaging, 2018 The recently developed speckle-based technique is a promising candidate for laboratory-based X-ray phase-contrast imaging due to its compatibility with polychromatic X-rays, multi-modality and flexibility.
Tunhe Zhou +3 more
doaj +1 more source
« On … on peut se reposer maintenant ? » :Foucault et les multiples subjectivités discursives de Spike [PDF]
Slayage, 2023 This article explores Spike’s development via a Foucauldian perspective of power and discourse. Discursive power resides in networks of relationships which allow “subjects [to] freely call upon differing discourses … and therefore, play games of identity”
Herrmann, Andrew F. +1 more
doaj
Laboratory Investigation of Skid Resistance for Steel Slag Utilization as Chip Seal [PDF]
, 2011 Slag as waste material of steel-making process has similar characteristics with aggregate that has been widely used in pavement construction. The use of slag as chip seal aggregate to provide skid resistance needs to be analyzed. In this laboratory study,
Daijiro Hori +11 more
core +2 more sources
Revista Árvore, 2008 A utilização da madeira de eucalipto na confecção de painéis MDF é recente, tornando-se necessário entender as modificações em sua estrutura anatômica durante as etapas do processo industrial, notadamente no desfibramento dos cavacos.
Ugo Leandro Belini +3 more
doaj +1 more source
Bench-to-bedside review: Dealing with increased intensive care unit staff turnover: a leadership challenge [PDF]
, 2005 Critical care leaders frequently must face challenging situations requiring specific leadership and management skills for which they are, not uncommonly, poorly prepared.
Burns, Judy +2 more
core +2 more sources
Implantable RF-coiled chip packaging [PDF]
, 2008 In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils.
Li, W., Rodger, D. C., Tai, Y. C.
core +1 more source
Optimal Card Design for Non-Linear HF RFID Integrated Circuits With Guaranteed Standard-Compliance
IEEE Access, 2018 The state-of-the-art design criteria for High Frequency (HF) Radio Frequency IDentification (RFID) cards at 13.56 MHz depend on the choice of a resonance frequency and a quality factor of the card.
Shrief Rizkalla +2 more
doaj +1 more source