Results 231 to 240 of about 119,632 (296)

An All-Soft Wearable Electrochemiluminescence Chip for Sweat Metabolite Detection. [PDF]

open access: yesAdv Sci (Weinh)
Nie W   +7 more
europepmc   +1 more source

Johari-Goldstein relaxation in quenched and irradiated chalcogenide glasses.

open access: yesNewton
Baglioni J   +8 more
europepmc   +1 more source

Cool Chips

IEEE Micro, 2011
This introduction to the special issue on Cool Chips discusses the state of low-power, high-speed chips and challenges facing researchers. It introduces five articles exploring different solutions to reducing power consumption and enhancing chip performance.
Makoto Ikeda, Fumio Arakawa
openaire   +1 more source

Cooling a Microprocessor Chip

Proceedings of the IEEE, 2006
Increasing microprocessor performance has historically been accompanied by increasing power and increasing on-chip power density, both of which present a cooling challenge. In this paper, the historical evolution of power is traced and the impact of power and power density on thermal solution designs is summarized.
Ravi Mahajan   +2 more
openaire   +1 more source

Keeping hot chips cool

Proceedings. 42nd Design Automation Conference, 2005., 2005
With 90nm CMOS in production and 65nm testing in progress, power has been pushed to the forefront of design metrics. This paper will outline practical techniques that are used to reduce both leakage as well as active power in a standard-cell library based high-performance design flow. We will discuss the design and cost issues for using different power
Ruchir Puri   +2 more
openaire   +1 more source

Guest Editors' Introduction: Cool Chips

IEEE Micro, 2009
Low-power and high-speed chips (Cool Chips) aim to reduce power consumption and enhance performance for applications ranging from multimedia to robotics. Industry is working to develop optimal solutions—both hardware and software—for power optimization according to the processor's required performance.
Makoto Ikeda, Fumio Arakawa
openaire   +1 more source

Cool chips III

IEEE Micro, 2000
These days the concept of architecting, designing, and implementing microprocessors is moving from high-power, high-speed results to low-power and high-speed objectives in a multimedia era. Of course, any processor is toward the same objective even though it is not for multimedia mobile systems.
openaire   +1 more source

A Digital-Microfluidic Approach to Chip Cooling

IEEE Design & Test of Computers, 2008
Thermal management has emerged as an increasingly important aspect of IC design. Elevated die temperatures are detrimental to circuit performance and reliability. Furthermore, hot spots due to spatially nonuniform heat flux in ICs can cause physical stress that further reduces reliability.
Philip Y. Paik   +2 more
openaire   +1 more source

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