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On-chip cooling for detectors in space applications
2008 IEEE Sensors, 2008Miniature Joule-Thomson (JT) coolers can be used for cooling small optical detectors. Both, cooler and detector can be integrated on a single chip by means of micro-electromechanical systems technology. For future space missions, the European Space Agency is interested in on-chip detector cooling for the temperature range 70 K - 250 K.
Derking, J.H. +4 more
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Convection cooling of microelectronic chips
[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 2003Mixed natural/forced convective heat transfer in a channel with heating elements is reported. Three microelectronic chps provided the heating surfaces. An experimental study was performed to determine the influence of the Reynolds number and Grashof number on the Nusselt number.
S. Konecni +3 more
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Science, 2009
ENGINEERING The heat that is generated by silicon chips in the integrated circuits at the heart of modern electronic devices must be efficiently removed, because the performance of field-effect transistors degrades at higher temperatures. One approach for providing active cooling next to a chip is to use thermoelectric materials, which effectively ...
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ENGINEERING The heat that is generated by silicon chips in the integrated circuits at the heart of modern electronic devices must be efficiently removed, because the performance of field-effect transistors degrades at higher temperatures. One approach for providing active cooling next to a chip is to use thermoelectric materials, which effectively ...
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Self-Cooling on Germanium Chip
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011As the scaling of silicon complementary metal-oxide-semiconductor devices becomes more and more challenging, both innovative device structures and new materials with high carrier mobility are needed to continue improving device performances. A metal-oxide-semiconductor field-effect transistor with germanium channel currently receives a resurgence of ...
null Peng Wang, A Bar-Cohen
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Why hot chips are no longer "cool"
Proceedings of the 2004 international symposium on Low power electronics and design, 2004Chip and system designers are battling a two front war -- extracting the last advantages from traditional semiconductor technology scaling on one front, while simultaneously working to contain skyrocketing chip power budgets on the other front. The impacts of this struggle are being felt across market segments far beyond the historic "low power ...
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Development of a chip-integrated micro cooling device
Microelectronics Journal, 2003Abstract An experimental/computation investigation was carried out to develop a MEMS-based micro cooling device to provide direct cooling to high heat flux electronics and MEMS devices. This device uses the electrohydrodynamic principles to pump and form an ultra thin film over a heated surface that requires cooling.
J. Darabi, K. Ekula
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An Optimal Parametric Design to Improve Chip Cooling
2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 2006Abstract The thermal problems of most electronic components have been solved in recent years by installing various cooling equipments. The passive cooling, which has no need of the fluid-driving devices, can be more reliable and achieved with less cost.
Yung-Shin Tseng +3 more
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Cooling potential of vortex tubes for chip hot spot cooling
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017In this study, the thermal performance of two commercially-available vortex tubes was investigated by measuring inlet and outlet pressures, temperatures, and flow rates. A variety of vortex generators, each with a unique combination of fin height and cold stream diameter, were tested for each vortex tube. Experiments were conducted over a wide range of
Kevin Drummond, Kamal Sikka
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