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Panel discussions: “Cool chips for the next decade”
2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS), 2017The advance of CMOS process is still going, but the end is coming into sight. Semiconductor chips with advanced process later than 21nm are so expensive that they are developed only for million selling products. On the other hand, the advanced AI, IoT and big data technologies require more and more computation/communication power with a tightly limited
Hideharu Amano +6 more
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On-Chip Thermoelectric Hotspot Cooling
2015Increased power density and non-uniform heat dissipation present a thermal management challenge in modern electronic devices. The non-homogeneous heating in chips results in areas of elevated temperature, which even if small and localized, limit overall device performance and reliability.
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Proceedings of the 45th annual Design Automation Conference, 2008
Thermal issues are becoming more important but is the hype getting the better of the facts? Does this deserve more attention than for some niche designs and technologies such as 3D ICs.? Does the broader design community need to worry about it at 32 nm and beyond or it will only impact a small segment of designs?
Ruchir Puri +6 more
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Thermal issues are becoming more important but is the hype getting the better of the facts? Does this deserve more attention than for some niche designs and technologies such as 3D ICs.? Does the broader design community need to worry about it at 32 nm and beyond or it will only impact a small segment of designs?
Ruchir Puri +6 more
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New Blood, Cool Chips, and Heterogeneous Designs
IEEE Micro, 2011This column discusses cool chips, and their place in the history of computing and current heterogeneous systems. This column also introduces the new Editorial Board members.
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"Hot" and "Cool" chips [Guest Editor's Introduction]
IEEE Micro, 1993The annual Hot Chips Symposium is always an interesting experience. For Hot Chips IV, the program committee (chaired by Dave Patterson and myself) once again had the pleasure (and difficulty) of selecting from too many interesting papers. The conference itself was a stimulating experience, bringing together a wide variety of people from both industry ...
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Embedded cooling method with configurability and replaceability for multi-chip electronic devices
Energy Conversion and Management, 2022Binbin Jiao, Yuxin Ye, Yanmei Kong
exaly
Multi-objective optimization of a chip-attached micro pin fin liquid cooling system
Applied Thermal Engineering, 2021Vahideh Radmard +2 more
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Case-embedded cooling for high heat flux microwave multi-chip array
Applied Thermal Engineering, 2022Chuan Chen, Qidong Wang, Meiying Su
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