Results 311 to 320 of about 802,912 (335)
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IEEE Design & Test, 2017
This issue of IEEE Design&Test is about self-aware SoCs. Now that’s an interesting topic. Most of the papers describe embedded sensors or measurement hardware, which allow the chip to compensate for variations in power, voltage, and temperature and can even detect and mitigate defects or the effects of aging.
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This issue of IEEE Design&Test is about self-aware SoCs. Now that’s an interesting topic. Most of the papers describe embedded sensors or measurement hardware, which allow the chip to compensate for variations in power, voltage, and temperature and can even detect and mitigate defects or the effects of aging.
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Flip chip micropallet technology-a chip-scale chip
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154), 2002The complex IC is a novel semiconductor construct, combining trailing edge ICs with leading edge ICs to solve integration problems. Using this approach gives the IC systems designer greater flexibility in working in the world of high speed and mixed technology.
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Genome-Wide Occupancy Analysis by ChIP-chip and ChIP-Seq
2011Interaction between protein complexes and the genome mediates essential functions including gene regulation, genome integrity, and chromatin organization. Recent advances in chromatin immunoprecipitaion (ChIP)-chip and ChIP-Seq technologies have enabled genome-wide identification of occupancy of transcription factors and modified histones that is ...
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