Results 121 to 130 of about 15,038,093 (347)

A CMOS test chip for 3D vision applications with high dynamic range

, 2003
This paper presents a CMOS smart pixel designed for scannerless, real-time, three-dimensional measurement systems, based on Indirect Time-Of-Flight technique.
Gonzo, Lorenzo, Gottardi, Massimo, Viarani, Luigi, Simoni, Andrea, Stoppa, David   +4 more
core  

Electrical Load Identification Using Fast Continuous Wavelet Transform and Spatiotemporal SNN

IEEE Access
Accurate and real-time electrical load identification technology has emerged as a critical requirement for ensuring electrical safety and enabling optimized energy management.
Xing Qin, Hanliang Liang, Zejun Pan, Chu Qin   +3 more
doaj   +1 more source

Genetic circuit design automation for yeast

Nature Microbiology, 2020
Ye Chen, Shuyi Zhang, E. Young, Timothy S. Jones, D. Densmore, Christopher A. Voigt   +5 more
semanticscholar   +1 more source

Electrochemical Behavior of Flame‐Sprayed Sc‐Doped AlCoCrFeMo High‐Entropy Alloy Coatings in 3.5% Sodium Chloride Solution

Advanced Engineering Materials, EarlyView.
Scandium (Sc)‐doped AlCoCrFeMo HEA coatings are fabricated via flame spraying with 0.1, 0.3, and 0.5 wt% Sc additions. Among these, the HEA‐Sc0.3 coating exhibits the highest corrosion resistance, indicated by a more positive corrosion potential and lower current density.
Pankaj Kumar, Akash Vyas, Mohammad Aatif Qazi, Nashit Jalal, Maria Ophelia Jarligo, Mostafa Yakout, Jing Liu, André McDonald   +7 more
wiley   +1 more source

Reconfigurable EIT Metasurface with Low Excited Conductivity of VO₂

Photonics
The active materials-loaded reconfigurable metasurface is a potential platform for terahertz (THz) communication systems. However, the requirements of the modulation performance and the modulation rate put forward the opposite requirements on the excited
Ruijie Li, Qiang Feng, Gaomou Lei, Qifan Li, Haixia Liu, Peng Xu, Jiaqi Han, Yan Shi, Long Li   +8 more
doaj   +1 more source

An Experimental High‐Throughput Approach for the Screening of Hard Magnet Materials

Advanced Engineering Materials, EarlyView.
An entire workflow for the high‐throughput characterization and analysis of compositionally graded magnetic films is presented. Characterization protocols, data management tools and data analysis approaches are illustrated with test case Sm(Fe, V)12 based films.
William Rigaut, Pierre Le Berre, Hamdi Jaballah, Lukas Fink, Victor Poline, Richard Haettel, Stéphane Grenier, Gilbert Chahine, Ewen Bellec, Guillaume Buatier, Wilfried Hortschitz, Santa Pile, Thomas Schrefl, Nils Blanc, Yuan Hong, Thibaut Devillers, Nora M. Dempsey   +16 more
wiley   +1 more source

Rule-based analog circuit design

, 2022
S.480-484A prototype of rule-based environment for analog integrated circuit design is presented. It features a hierarchical design style, multifunctionality, and adaption capability for its knowledge bases.
Klinke, R., Fiedler, H.-L., Hosticka, B.J., Münster, I., Kokozinski, R.   +4 more
core  

Reconfigurable Logic‐in‐Memory Operations Enabled by Triple‐Gated Feedback Field‐Effect Transistors for Area‐Efficient Computing

Advanced Engineering Materials, EarlyView.
A reconfigurable logic‐in‐memory cell composed of triple‐gated feedback field‐effect transistors implements multiple combinational logic functions within a single configuration. By utilizing program gates as dynamic input terminals, the proposed cell performs full adder, full subtractor, 2‐to‐1 multiplexer, and 4‐to‐2 encoder operations without ...
Minhyeok Seol, Yunwoo Shin, Donghyung Lee, Dongki Kim, Kyoungah Cho, Sangsig Kim   +5 more
wiley   +1 more source

A Genetic Circuit Design for Targeted Viral RNA Degradation. [PDF]

Bioengineering (Basel), 2023
Bello AJ, Popoola A, Okpuzor J, Ihekwaba-Ndibe AE, Olorunniji FJ.   +4 more
europepmc   +1 more source

Triple Junctions as Dislocation‐Like Defects: The Role of Grain Boundary Crystallography Revealed by Experiment and Atomistic Simulation

Advanced Engineering Materials, EarlyView.
Grain boundary triple junctions are an essential ingredient of the microstructure of polycrystalline materials. In this study, a triple junction is observed using atomic‐resolution scanning transmission electron microscopy and characterized. Computer simulations reveal that the junction has a dislocation character that is determined by the joining ...
Tobias Brink, Saba Saood, Peter Schweizer, Jörg Neugebauer, Gerhard Dehm   +4 more
wiley   +1 more source