A subclass of close-to-convex functions subordinate to a bilinear transformation
Gagandeep Singh, Gurcharanjit Singh
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Recent Progress on Flexible Multimodal Sensors: Decoupling Strategies, Fabrication and Applications
In this review, we establish a tripartite decoupling framework for flexible multimodal sensors, which elucidates the underlying principles of signal crosstalk and their solutions through material design, structural engineering, and AI algorithms. We also demonstrate its potential applications across environmental monitoring, health monitoring, human ...
Tao Wu +10 more
wiley +1 more source
Multivalently Close-to-Convex Functions [PDF]
openaire +2 more sources
Multi‐Material Gradient Printing Using Meniscus‐enabled Projection Stereolithography (MAPS)
MAPS is a new vat‐free printing technique that utilizes programmed delivery of resin droplets with custom formulations to enable multi‐material gradient printing of 3D structures with user‐defined variations in mechanical stiffness, opacity, surface energy, cell densities, and magnetic properties. Abstract Light‐based additive manufacturing methods are
Puskal Kunwar +10 more
wiley +1 more source
Extremal Problems in the Class of Close-to-Convex Functions [PDF]
Bernard Pinchuk
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Sharp Bounds of the Hermitian Toeplitz Determinants for Some Classes of Close-to-Convex Functions [PDF]
Adam Lecko, Barbara Śmiarowska
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4D Bioprinted Self‐Folding Scaffolds Enhance Cartilage Formation in the Engineering of Trachea
A bilayer self‐folding scaffold, triggerable by humidity, is fabricated via 4D bioprinting for trachea engineering. An analytical model is derived to predict its radius of curvature, enabling its scalability. Cartilage progenitor cells seeded on the scaffold perceive scaffold final curvature and react to it, by enhancing the upregulation of pro ...
Irene Chiesa +4 more
wiley +1 more source
On certain properties for a subclass of close-to-convex functions [PDF]
Sukriti Goyal, Pranay Goswami
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Refinements of Some Integral Inequalities for
Ghulam Farid +5 more
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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source

