Results 141 to 150 of about 47,494 (264)

Multispectral image fusion via heterogeneous integration of broadband image sensor and sub‑Boltzmann Transistors on CMOS. [PDF]

open access: yesNat Commun
Devnath A   +12 more
europepmc   +1 more source

From Sensing Mechanisms to System Co‐Design: Graphene‐Based Sensors and Readout Circuits

open access: yesAdvanced Science, EarlyView.
This review establishes a unified PS–EQ–RF framework linking graphene sensing mechanisms, native electrical outputs, and output‐specific readout circuits. Voltage‐, current‐, resistance‐, and capacitance‐type sensing systems are systematically classified to guide architecture selection, low‐noise design, system co‐design, and practical integration ...
Jinduo Zhang   +5 more
wiley   +1 more source

Deterministic Switching-Path Engineering of CMOS-Integrated 2D Memristors for Neuromorphic Computing. [PDF]

open access: yesSmall
Yang J   +12 more
europepmc   +1 more source

A Reconfigurable Memristive Spiking Neuron Enabling Advanced Neuromorphic Computing

open access: yesAdvanced Science, EarlyView.
Pek Jun Tiw and co‐workers develop a reconfigurable memristive neuron that can exhibit four spiking behaviors with freely tunable spike train parameters. The neuron supports multiplexed spike encoding of multiple pieces of information. It also supports advanced neural network strategies, such as neural heterogeneity and dynamic mode switching ...
Pek Jun Tiw   +6 more
wiley   +1 more source

Triple‐Level Content‐Addressable Vertical NAND Flash Memory

open access: yesAdvanced Science, EarlyView.
Commercial triple‐level‐cell V‐NAND flash memory is transformed into a compact content‐addressable memory by directly exploiting its eight threshold‐voltage states. A parity‐split search scheme preserves storage density while enabling reliable multi‐level and don't‐care matching. Parallel word‐line search delivers up to 24‐fold higher throughput and 54.
Sung‐Ho Park   +8 more
wiley   +1 more source

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

open access: yesAdvanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim   +5 more
wiley   +1 more source

Capacitive Sensors and Actuators by CMOS MEMS Foundry. [PDF]

open access: yesMicromachines (Basel)
Yang LJ   +5 more
europepmc   +1 more source

Nickel Intercalation in Epitaxial Graphene on SiC(0001): A Novel Platform for Engineering Two‐Dimensional Heterostructures

open access: yesAdvanced Science, EarlyView.
Ni‐intercalated graphene on SiC is achieved through a scalable colloidal nanoparticle deposition route. 2D heterostructures show preserved graphene band structure, stable under ambient conditions, and robust interfacial magnetism. Intercalated 2D Ni represents a promising candidate for next‐generation spintronic devices and is a scalable pathway to ...
Ylea Vlamidis   +7 more
wiley   +1 more source

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