Results 221 to 230 of about 30,697 (264)
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Effect of functionalisation of CNT in the preparation of HAp–CNT biocomposites
Ceramics International, 2015Hydroxyapatite (HAp)–carbon nanotube (CNT) composites are being fabricated, where CNT acts as a reinforcement in the ceramic matrix. CNT improves the mechanical property of HAp and offers a potential implant material used for orthopaedic applications.
Susmita Mukherjee +3 more
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Effective Dispersion of CNTs to Fabricate CNT/Mg Nanocomposite
Materials Science Forum, 2015An effective dispersion process to cast CNT-reinforced in a concentrated magnesium alloy (AZ31) nanocomposite was investigated in this study. The metal magnesium powder was first coated with dispersed CNTs by wet process, followed by the fabricating of CNT/Mg precursor using mechanical briquetting and extrusion.
Guo Qiang Han +5 more
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Finite element modeling of two different CNT/polymer composites: CNT/PMMA and CNT/PmPV
2011 IEEE Nanotechnology Materials and Devices Conference, 2011Carbon nanotube (CNT) in polymeric matrix is investigating due to improvement of the structural, mechanical, thermal and electronic properties of resulting CNT/polymer composite. This improvement depends on: properties, features and volume fractions of CNTs and polymer. In this paper, there are three main parts for using an analysis on a finite element
A. Nickkholgh, P. Keyvani
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Influence of CNT Diameter and Annealing on the Tensile Property of CNT by Using Untwisted CNT Yarn
The Proceedings of the Materials and Mechanics Conference, 2022Yoshinobu SHIMAMURA +3 more
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2020
The chapter will start with brief introduction to the interconnects and its importance in an integrated circuit at deep sub-micron technology nodes. The brief discussion about the concept of scaling, interconnects models, and material in use are presented. The limitations of conventional materials at scaled down technology nodes will be discussed next.
openaire +1 more source
The chapter will start with brief introduction to the interconnects and its importance in an integrated circuit at deep sub-micron technology nodes. The brief discussion about the concept of scaling, interconnects models, and material in use are presented. The limitations of conventional materials at scaled down technology nodes will be discussed next.
openaire +1 more source

