Results 41 to 50 of about 603,802 (169)

International stock markets : a co-integration analysis [PDF]

, 2011
This study investigates the degree of co-integration between five major European stock markets and five major non European stock markets. The results show that all five major European stock markets are co-integrated either positively or negatively, while among the five major non European the Canadian, the Japanese and the Singapore are non cointegrated
Eleftherios J. Thalassinos, Evagelos D. Politis   +1 more
openaire   +1 more source

Implementing an intelligent diagnosis and treatment system for in-hospital cardiac arrest in the Utstein style: a multi-center case study

Journal of Translational Medicine
Background Cardiac arrest presents a variety of causes and complexities, making it challenging to develop targeted treatment plans. Often, the original data are either inadequate or lack essential patient information.
Yan Shao, Zhou Yang, Wei Chen, Yingqi Zhang   +3 more
doaj   +1 more source

Full Coverage Testing Method for Automated Driving System in Logical Scenario Parameters Space

Sensors
Scenario-based testing is a mainstream approach for evaluating the safety of automated driving systems (ADS). However, logical scenarios are defined through parameter spaces, and performance differences among systems under test make it difficult to ...
Haitao Min, Zhiqiang Zhang, Tianxin Fan, Peixing Zhang, Cheng Zhang, Ge Qu   +5 more
doaj   +1 more source

Design of security situation awareness power grid SCADA system based on improved GWO-LSTM

Scientific Reports
A grid supervisory control and data acquisition system is developed in this study to address the problem that the existing power grid information system often fails to achieve the high-precision requirements of modern power grid situational awareness. By
Zhenshan Chen, Hanjun Zheng, Lizhen Gao, Fengxing Qiu, Huihai Huang, Shufeng Liu   +5 more
doaj   +1 more source

Classification of brain states that predicts future performance in visual tasks based on co-integration analysis of EEG data. [PDF]

R Soc Open Sci, 2022
Levakova M, Christensen JH, Ditlevsen S.
europepmc   +1 more source

Wafer-scale fabrication of solid-state nanopore array with a novel SpacerX process

Microsystems & Nanoengineering
Solid-state nanopores (SSNPs) have emerged as a transformative platform in nanotechnology and biotechnology, yet their application is limited by the lack of cost-effective, reproducible fabrication technology.
Lihuan Zhao, Jiajun Wang, Lin-Sheng Wu, Xin Zhao   +3 more
doaj   +1 more source

Impact of oil prices, the U.S interest rates on Turkey's real estate market. New evidence from combined co-integration and bootstrap ARDL tests. [PDF]

PLoS One, 2021
Alhodiry A, Rjoub H, Samour A, Samour A.
europepmc   +1 more source

Multiomics analysis to explore blood metabolite biomarkers in an Alzheimer’s Disease Neuroimaging Initiative cohort

Scientific Reports
Alzheimer's disease (AD) is a neurodegenerative disease that commonly causes dementia. Identifying biomarkers for the early detection of AD is an emerging need, as brain dysfunction begins two decades before the onset of clinical symptoms.
Takaki Oka, Yuki Matsuzawa, Momoka Tsuneyoshi, Yoshitaka Nakamura, Ken Aoshima, Hiroshi Tsugawa, the Alzheimer’s Disease Metabolomics Consortium   +6 more
doaj   +1 more source

Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging

Materials & Design
The increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness.
Fupeng Huo, Chuantong Chen, Zheng Zhang, Ye Wang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma   +8 more
doaj   +1 more source

Mechanism of void growth in electroless copper plating layer of microvias in high-density interconnect packaging substrates

Journal of Materials Science: Materials in Engineering
Voids in electroless copper (Cu) plating layers critically influence the reliability of microvias in high-density interconnect (HDI) packaging substrates.
Ming-chun Hsieh, Zheng Zhang, Masahiko Nishijima, Rieko Okumura, Hiroki Seto, Hiroshi Nishikawa, Katsuaki Suganuma   +6 more
doaj   +1 more source