Results 121 to 130 of about 7,462,170 (375)

Recent Advancements in Bulk Processing of Rare‐Earth‐Free Hard Magnetic Materials and Related Multiscale Simulations

open access: yesAdvanced Engineering Materials, EarlyView.
This article provides an overview of recent advancements in bulk processing of rare‐earth‐free hard magnetic materials. It also addresses related simulation approaches at different scales. The research on rare‐earth‐free magnetic materials has increased significantly in recent years, driven by supply chain issues, environmental and social concerns, and
Daniel Scheiber, Andrea Bachmaier
wiley   +1 more source

Deciphering solar magnetic activity: some (unpopular) thoughts on the coupling of the Sun’s “weather” and “climate”

open access: yesFrontiers in Astronomy and Space Sciences
The Sun exhibits episodic surges of magnetic activity across a range of temporal and spatial scales, the most prominent of which is the 11-th year modulation of sunspot production.
Scott W. McIntosh   +4 more
doaj   +1 more source

АНАЛИТИЧЕСКИЙ ДИСКУРС И ПРОБЛЕМА ЛИЧНОСТИ: ЯЗЫКОВАЯ КОММУНИКАЦИЯ И СОЦИАЛЬНЫЕ «ИГРЫ» КАК ОНТОЛОГИЯ, АКСИОЛОГИЯ И ГНОСЕОЛОГИЯ ЧЕЛОВЕКА [PDF]

open access: yes, 2013
Рассматриваются формы исследования и анализа челове- ческого бытия, связанные со сферой взаимодействия языка, сознания и существования человека. Рассматриваются аналитические методоло- гии постижения проблем познания мира и жизнедеятельности человека ...
Зінченко, Віктор Вікторович
core  

Challenges during Flash Lamp Annealing of Aerosol‐Deposited Barium Titanate Films

open access: yesAdvanced Engineering Materials, EarlyView.
Aerosol deposition is used to rapidly deposit barium titanate films with thicknesses ranging from 2 to 16 μm at room temperature, eliminating the need for further densification. However, to recover the electromechanical properties, annealing is required, which limits the usage of temperature‐sensitive substrates.
Michel Kuhfuß   +7 more
wiley   +1 more source

Advancing Research on Biomaterials and Biological Materials with Scanning Electron Microscopy under Environmental and Low Vacuum Conditions

open access: yesAdvanced Engineering Materials, EarlyView.
Herein, environmental scanning electron microscopy (ESEM) is discussed as a powerful extension of conventional SEM for life sciences. By combining high‐resolution imaging with variable pressure and humidity, ESEM allows the analysis of untreated biological materials, supports in situ monitoring of hydration‐driven changes, and advances the functional ...
Jendrian Riedel   +6 more
wiley   +1 more source

Enhanced Oxidation and Thermal Shock Resistance of N‐type Mg2Si0.89(Sn0.1,Sb0.01) Thermoelectric Material via Cr0.9Si0.1 Coating

open access: yesAdvanced Engineering Materials, EarlyView.
Cr0.9Si0.1 protective coatings are developed to enhance the thermal‐shock and oxidation resistance of Mg2Si0.89(Sn0.1,Sb0.01) thermoelectric (TE) materials. The coating forms a dense and adherent barrier that suppresses oxygen diffusion and mitigates mechanical degradation during cyclic oxidation, demonstrating its potential to improve the long‐term ...
Mikdat Gurtaran   +3 more
wiley   +1 more source

Spatial localization of knowledge-transfer channels and face-to-face contacts: A survey of the Jena university-industry linkages [PDF]

open access: yes
In this paper we examine the knowledge-Transfer Channels of the universities and public research institutes in Jena. The empirical study is based on a survey of 297 personal interviews with researchers of both types of organisations. Our study focuses on
Gerlach, Andrea   +2 more
core  

Microstructural Evolution and Mechanical Performance of Plasma‐Assisted Hybrid Friction Stir Welded Dissimilar Aluminum–Copper Joints

open access: yesAdvanced Engineering Materials, EarlyView.
Plasma‐assisted hybrid friction stir welding of dissimilar AlCu joints employs localized plasma preheating to balance heat input and enhance plastic flow. The optimized process reduces axial force by up to 35%, refines the microstructure, and achieves ≈96% joint efficiency.
Deepak Kumar Yaduwanshi   +3 more
wiley   +1 more source

An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations

open access: yesMicromachines
The high input/output demands of memory packages require precise trace width and spacing, posing challenges for contemporary package design. Substrate copper trace cracks are a major reliability issue during temperature cycling tests (TCTs).
Wei Yu   +7 more
doaj   +1 more source

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