Results 151 to 160 of about 213,482 (341)

Opportunities for Multiscale Pattern Modulation with Temporally Arrested Breath Figures

open access: yesAdvanced Materials Interfaces, EarlyView.
This works presents the temporally arrested breath figure methodology and its opportunities for pattern modulation. Through thermodynamic and photochemical phase change handles, this method uses drop‐wise condensation as a dynamic template for fast, accessible and scalable micropatterning.
Francis J. Dent   +5 more
wiley   +1 more source

The fate of overgrown germlings in coalescing Rhodophyta

open access: green, 2004
B. Santelices   +3 more
openalex   +2 more sources

Loading Mode Dependence of Twin‐Twin Boundary Formation in a Textured Magnesium Alloy

open access: yesAdvanced Materials Interfaces, EarlyView.
The structures of twin‐twin boundaries formed by interactions between twin variants sharing the same or different zone axes in a deformed magnesium alloy are demonstrated. Lattice distortion around complicated interfaces promotes grain refinement in the subsequent thermomechanical process, enhancing the mechanical performance of magnesium alloys ...
Yuzhi Zhu   +7 more
wiley   +1 more source

Continuum-sites stepping-stone models, coalescing exchangeable partitions and random trees [PDF]

open access: bronze, 2000
Peter Donnelly   +4 more
openalex   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

open access: yesAdvanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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