Results 171 to 180 of about 448,185 (251)
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Coefficient of thermal expansion of AlMgB14
Scripta Materialia, 2002Abstract The coefficient of thermal expansion (COTE) of AlMgB14 was measured by dilatometry and by high temperature X-ray diffraction using synchroton radiation. The COTE over the temperature range 298 K to 1373 K was determined to be 9×10−6 K−1, which is relatively close to the value of 8.3×10−6 K−1 for pure B.
A.M. Russell +3 more
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Thermal Expansion Coefficients of Bismuth
Journal of Applied Physics, 1960The linear thermal expansion coefficients of the a and c axes of bismuth have been measured from 80°K to 540°K by mechanical means. These same coefficients were determined over a more limited range of temperatures by single crystal and powder x-ray methods. The mechanical and x-ray values did not differ significantly.
E. F. Cave, L. V. Holroyd
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Prediction method of thermal expansion coefficient for 2D composite fabric
Mechanics of Advanced Materials and StructuresIn this article, an analytical method for predicting the thermal expansion coefficient of 2D composite fabrics is established. First of all, different from the traditional prediction of thermal expansion coefficient by classical laminate theory, this ...
Zihui Deng +6 more
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Effect of coefficient of thermal expansion on microleakage
The Journal of the American Dental Association, 1988This study examines the relationship between thermal coefficient of expansion and microleakage. Six restorative materials with varying coefficients of thermal expansion were thermocycled in basic fuschin dye and compared for relative microleakage. The use of dental restorative materials with low coefficients of thermal expansion such as glass ionomer ...
R H, Bullard +2 more
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Journal of Alloys and Compounds, 2019
Cu-B matrix composites reinforced with diamond particles (Cu-B/diamond) were prepared by gas pressure infiltration (GPI). The effect of boron addition in the range of 0–1.0 wt% on the thermal expansion behavior of the Cu-B/diamond composites was ...
Guangzhu Bai +8 more
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Cu-B matrix composites reinforced with diamond particles (Cu-B/diamond) were prepared by gas pressure infiltration (GPI). The effect of boron addition in the range of 0–1.0 wt% on the thermal expansion behavior of the Cu-B/diamond composites was ...
Guangzhu Bai +8 more
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Measurement of thermal expansion coefficient of human teeth
Australian Dental Journal, 1989AbstractThe coefficient of thermal expansion of specimens from 60 freshly extracted human teeth were measured over the range 10–80°C using a dilatometer. The coefficient increased rapidly above 50°C, but there was no significant variation with tooth age between 10 and 70 years.
H C, Xu, W Y, Liu, T, Wang
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Journal of Materials Research, 2019
In this study, the effects of lithium(Li) content (1.0, 1.5, 2.0, and 2.5 wt%) on the microstructure, micro-yield strength (MYS) and coefficient of thermal expansion (CTE) of Al–Cu–Mg–Li–Sc–Ag alloys were investigated.
R. Yang +4 more
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In this study, the effects of lithium(Li) content (1.0, 1.5, 2.0, and 2.5 wt%) on the microstructure, micro-yield strength (MYS) and coefficient of thermal expansion (CTE) of Al–Cu–Mg–Li–Sc–Ag alloys were investigated.
R. Yang +4 more
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The coefficient of thermal expansion of stroma
Experimental Eye Research, 1971Abstract Rabbit stroma has a negative coefficient of thermal expansion. Upon raising the temperature of a bare stroma, 200 μm thick, from 1–37°C while bathed in isotonic saline and loaded to 53 mmHg swelling pressure the thickness decreases about 14 μm. An increase in thickness of about the same amount can be observed upon cooling a bare stroma. This
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Thermal Expansion Coefficients of Unidirectional Composites
Journal of Composite Materials, 1978An analytical and experimental investigation on thermal expansion coef ficients of unidirectional composites (UD) is carried out. The fiber aniso tropy and temperature dependency of the constituent material properties are considered in the formulation of the problem.
Takashi Ishikawa +2 more
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Macromolecules, 2018
The development of polyimides (PIs) with a superheat resistance and a high thermal dimensional stability is required urgently for application in the rapidly growing area of flexible-display substra...
M. Lian, Xuemin Lu, Q. Lu
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The development of polyimides (PIs) with a superheat resistance and a high thermal dimensional stability is required urgently for application in the rapidly growing area of flexible-display substra...
M. Lian, Xuemin Lu, Q. Lu
semanticscholar +1 more source

