Results 161 to 170 of about 3,274,533 (303)

Genetic-Algorithm-Assisted Multiuser Detection in Asynchronous CDMA Communications

open access: yes, 2004
—In an asynchronous direct-sequence code-division multiple-access, a specific bit of the reference user is interfered by two asynchronously arriving surrounding bits of all the other users supported by the system.
YEN, K., HANZO, L.
core   +1 more source

Sub-picosecond synchronized multi-faceted fronthaul with one-sample-per-symbol coherent detection. [PDF]

open access: yesNat Commun
Zhang C   +9 more
europepmc   +1 more source

Ultrafast polarization bio-imaging based on coherent detection and time-stretch techniques. [PDF]

open access: yesBiomed Opt Express, 2018
Song L   +11 more
europepmc   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

open access: yesAdvanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz   +4 more
wiley   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

open access: yesAdvanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Ultra-low noise optical injection locking amplifier with AOM-based coherent detection scheme. [PDF]

open access: yesSci Rep, 2018
Feng Z   +8 more
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

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