Genetic-Algorithm-Assisted Multiuser Detection in Asynchronous CDMA Communications
—In an asynchronous direct-sequence code-division multiple-access, a specific bit of the reference user is interfered by two asynchronously arriving surrounding bits of all the other users supported by the system.
YEN, K., HANZO, L.
core +1 more source
Sub-picosecond synchronized multi-faceted fronthaul with one-sample-per-symbol coherent detection. [PDF]
Zhang C +9 more
europepmc +1 more source
Ultrafast polarization bio-imaging based on coherent detection and time-stretch techniques. [PDF]
Song L +11 more
europepmc +1 more source
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Performance Optimization of Nonorthogonal MFSK for Symbol-by-Symbol Coherent Detection. [PDF]
Rugini L.
europepmc +1 more source
Characterization of Nucleobases in Broadband Terahertz Spectra from 0.5 to 10 THz with the Air-Biased-Coherent-Detection Technique. [PDF]
Yu M +6 more
europepmc +1 more source
Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley +1 more source
Bending-Aware Spectrogram Correlation for W-Band Quadcopter Detection: A Physics-Informed Non-Coherent Detection Framework. [PDF]
Balal Y +3 more
europepmc +1 more source
Ultra-low noise optical injection locking amplifier with AOM-based coherent detection scheme. [PDF]
Feng Z +8 more
europepmc +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source

