Results 211 to 220 of about 219,060 (303)

Flexible Unusual Ternary‐Component Graded‐Modulus Dielectric Films with High‐Density Capacitive Energy Storage

open access: yesAdvanced Science, EarlyView.
Hierarchical PP–LSR107–BaTiO3 nanocomposite films are fabricated by one‐step extrusion and stretching for roll‐to‐roll manufacture, combining high energy storage and processing flexibility. LSR107 surrounds BaTiO3‐rich regions, locating amorphous PP, decreasing defects, and introducing deep traps that homogenize the electric field and suppress charge ...
Yi Gao   +14 more
wiley   +1 more source

A Crack‐Based One‐Dimensional Microspheres Array Enables Thermal–Mechanical Decoupled Dual‐Functional Sensing

open access: yesAdvanced Science, EarlyView.
Inspired by Nostoc, a crack‐based one‐dimensional microspheres array (COMA) sensor is developed, which stabilizes crack geometry under isotropic expansion, enabling a predictable, monotonic thermal response from which true strain can be accurately extracted. The COMA sensor exhibits high sensitivity at ultralow deformation (gauge factor up to 89) and a
Wanqing Xu   +7 more
wiley   +1 more source

EU Citizenship and EU Entities: New Perspectives for Citizens and Companies

open access: yesWroclaw Review of Law, Administration and Economics, 2013
Guzewicz Agnieszka
doaj   +1 more source

Engineering Neuronal Network Connectivity Through Precise and Scalable Electrical Modulation

open access: yesAdvanced Science, EarlyView.
This study presents a scalable all‐electrical method for precise neuronal‐circuit reconfiguration based on high‐density microelectrode arrays. By employing biologically inspired plasticity rules, targeted connectivity changes were successfully induced and quantified across diverse neuronal preparations.
Sreedhar S. Kumar   +10 more
wiley   +1 more source

Hospital finances following Connecticut's ban on outpatient facility fees. [PDF]

open access: yesHealth Aff Sch
Braun RT   +4 more
europepmc   +1 more source

Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors

open access: yesAdvanced Science, EarlyView.
 . ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton   +4 more
wiley   +1 more source

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