Results 151 to 160 of about 569,305 (336)
Designing of Self‐Dispersing Soft Dendritic Microcleaners for Microplastics Capture and Recovery
Advanced Functional Materials, EarlyView.The capture and recovery of microplastics from open aquatic systems is a complex problem, which necessitates nontrivial solutions. The principles of a comprehensive multistage process based on sustainably sourced microcleaners with hierarchical morphology are demonstrated.
Haeleen Hong +3 more
wiley +1 more source
On the first countability axiom for locally compact Hausdorff spaces [PDF]
, 1959 F. Burton Jones
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Compact sheaves on a locally compact space
Proceedings of the American Mathematical SocietyLet X X be a hypercomplete locally compact Hausdorff space and let C \mathcal C be a compactly generated stable ∞ \infty -category. We describe the compact objects in the ∞ \infty -category of C \mathcal C -valued sheaves S
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Compact C-spaces and S-spaces [PDF]
, 1977 We introduce a set theoretic axiom Open image in new window which is weaker than Open image in new window as well as axiom F. Using (CH) and Open image in new window we prove the existence of a locally compact, T2, locally countable, first countable, hereditarily separable, sequentially compact non-compact space X.
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Advanced Functional Materials, EarlyView.A simulation technique for assessing both the fabrication and operation of a solid‐state Si battery is demonstrated by integrating particle dynamics with mass/charge transport. Although, the fabrication pressure (Pfab) increased the inter‐particle contacts and reduced the concentration (ηconc) and Li‐ion (ηLi+) overpotentials during discharging, it ...
Magnus So +4 more
wiley +1 more source
On the existence of rigid compact ordered spaces [PDF]
, 1968 J. de Groot, Maarten Maurice
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Carbon Nanotube 3D Integrated Circuits: From Design to Applications
Advanced Functional Materials, EarlyView.As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu +3 more
wiley +1 more source