Results 131 to 140 of about 78,554 (174)
Advanced Functional Materials, EarlyView.Spider minor ampullate silk protein (MiSp) and retinoic acid (RA) based nanovaccine are capable of eliciting both mucosal and systemic immune responses following subcutaneous administration and demonstrate significant protective effects against CVB3 infection in mice.
Xingmei Qi +4 more
wiley +1 more source
COMPATIBILITY RESEARCH LIMITEDV.COMPUTER PSYCHE COMPANY LIMITED [PDF]
, 1967 openalex +1 more source
Advanced Functional Materials, EarlyView.This study presents excellent EMI shielding effectiveness of highly crystalline HC‐Ti3C2Tx MXene, characterized by high electrical conductivity, outstanding environmental stability, and facile processability, across a multispectral frequency range from 100 kHz to 110 GHz. It is revealed that increasing the thickness and electrical conductivity of MXene
Aamir Iqbal +13 more
wiley +1 more source
The Relation between Particle Size of Iron Oxides and Pigment Compatibility
, 1963 Soichiro NOBUOKA +3 more
openalex +2 more sources
Advanced Functional Materials, EarlyView.Biomolecular condensates have central functions in cells and are also observed during the assembly of biological materials such as silks. For a mini‐spidroin protein, the presence of long‐lived metastable or dynamically arrested intermediate states leads to complex pathways and difficulties in identifying equilibrium states. Constructing phase diagrams
Dmitrii Fedorov +8 more
wiley +1 more source
High-temperature irradiation of niobium-1 w/o zirconium-clad UO/sub 2/. [Compatibility with lithium]
, 1965 M. Kangilaski +4 more
openalex +2 more sources
Advanced Mycelium Skins for Sustainable Electronics
Advanced Functional Materials, EarlyView.Mycelium skins are sustainable substrates for high‐performance electronic devices, enabling a green future. Environmentally friendly post‐growth treatments extend their durability and significantly improve their mechanical and electrical properties while maintaining their thermal stability and biodegradability.
Roland Pruckner +11 more
wiley +1 more source
COMPATIBILITY OF REFRACTORY METALS WITH SOLID SOLUTION (UC)(ZrC) AT ELEVATED TEMPERATURES
, 1965 K.V. Davidson, R.E. Riley, J.M. Taub
openalex +2 more sources
Direct Ink Writing of Conductive Hydrogels
Advanced Functional Materials, EarlyView.This review examines the use of direct ink writing (DIW) for fabricating conductive hydrogels with customizable 3D structures. It outlines the rheological requirements for successful DIW, followed by an exploration of the materials and ink formulations used to impart electronic and/or ionic conductivity to hydrogels while maintaining printability ...
Monica Ho +6 more
wiley +1 more source
HIGH-TEMPERATURE COMPATIBILITY TESTING OF MOLTEN PLUTONIUM FUEL-CONTAINER SYSTEMS
, 1965 R.L. Andelin
openalex +2 more sources