Results 261 to 270 of about 3,807 (309)

Higher resonance schemes and Koszul modules of simplicial complexes. [PDF]

open access: yesJ Algebr Comb (Dordr)
Aprodu M   +4 more
europepmc   +1 more source

Dynamic Micromechanical Characterization of 3D Printed Bone In Vitro Models Manufactured via Vat Photopolymerization

open access: yesAdvanced Functional Materials, EarlyView.
This study presents a novel approach to designing and fabricating high‐porosity 3D‐printed scaffolds using a customized resin. Scaffold geometry, cellular interactions, and mechanical properties are analyzed to demonstrate these engineered bone models.
Sera Choi   +6 more
wiley   +1 more source

Versatile Selective Soldering via Molten Metal Printing for Heat‐Sensitive 3D Electronics and Smart Wearables

open access: yesAdvanced Functional Materials, EarlyView.
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger   +4 more
wiley   +1 more source

Print‐and‐Plate Architected Electrodes for Electrochemical Transformations Under Flow

open access: yesAdvanced Functional Materials, EarlyView.
Typical flow cell electrodes are composed of stochastic porous carbon, limiting understanding of electrode structure‐performance relationships. This work describes an approach, termed “print‐and‐plate,” to prepare porous electrodes by direct ink writing followed by conformal metal coating.
Dylan M. Barber   +12 more
wiley   +1 more source

Foliation adjunction. [PDF]

open access: yesMath Ann
Cascini P, Spicer C.
europepmc   +1 more source

Harnessing Outer Space for Improved Electrocaloric Cooling

open access: yesAdvanced Functional Materials, EarlyView.
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo   +8 more
wiley   +1 more source

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