Additive manufacturing revolutionizes production by enabling on‐demand, customized, and sustainable manufacturing with streamlined supply chains. While metal and polymer AM are well‐established, advanced ceramic AM is rapidly emerging, overcoming traditional material challenges.
Kateryna Oleksandrivna Shvydyuk +2 more
wiley +1 more source
Computational analysis of blood flowing through an artery with post stenotic dilatation by implying Sisko model parametric approach. [PDF]
Hussain A, Dar MNR, Iftikhar A.
europepmc +1 more source
MEMS‐Based Magnetoelectric Antennas for Wireless Power Transmission in Brain‐Implantable Devices
Magnetoelectric (ME) antennas allow the minimization of the invasiveness of brain implantable devices, via powering wirelessly systems able to actuate neural tissue. In order to achieve the necessary power efficiency transmission, the choice of the materials and the system assembly is vital.
Laura Mazón‐Maldonado +5 more
wiley +1 more source
Rupture risk assessment for AComA aneurysms with morphological, hemodynamic and structural mechanical analysis. [PDF]
Nagy J +14 more
europepmc +1 more source
Seismic analysis and design of steel-plate concrete composite shear wall piers
S. Epackachi, A. Whittaker, A. Aref
semanticscholar +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Experimental and numerical research on the anisotropic compressive mechanical behavior of layered rock. [PDF]
Liu Q, Zhang C, Hou J, Li L.
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Study on the loss of load-carrying capacity of thin-walled composite columns with closed cross-sections. [PDF]
Rozylo P.
europepmc +1 more source

