Results 91 to 100 of about 192,980 (275)
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Spectroscopic measurements in photochemistry. V. Computational chemistry in photochemistry.
Suehiro Iwata, Shinkoh Nanbu
openalex +2 more sources
Recent updates in click and computational chemistry for drug discovery and development. [PDF]
Cai JH+6 more
europepmc +1 more source
Women in Computational Chemistry [PDF]
Habibah A Wahab+2 more
openaire +3 more sources
The fused filament‐fabricated MAR‐M247 alloy without hot isostatic pressing shows the lowest porosity of 4%. Heat treatment at 1220 °C produces coarse precipitates and carbides. Specimens heat‐treated at 1220 °C exhibit higher tensile strength (683 MPa) and elongation (10%) at room temperature.
Haneen Daoud+7 more
wiley +1 more source
Steel samples are investigated using complementary simulations and measurements. Transmission electron microscopy in bright‐field mode, combined with energy‐dispersive X‐ray spectroscopy maps for titanium and niobium, reveals distinct particle populations. Simulations reproduce these in size and composition.
Marc Laub+3 more
wiley +1 more source
Computational Chemistry Column: Combined Quantum Mechanical and Molecular Mechanical Approaches
Tiziana Mordasini, Walter Thiel
openalex +2 more sources
Novel Grafted Hydrogel for Iron and Ammonia Removal from Groundwater: A Synthesis and Computational Chemistry Study. [PDF]
Abd El-Salam HM+3 more
europepmc +1 more source