Results 181 to 190 of about 1,551,089 (266)

Low‐Activation Compositionally Complex Alloys for Advanced Nuclear Applications—A Review

open access: yesAdvanced Engineering Materials, EarlyView.
Low‐activation compositionally complex alloys (LACCAs) are advanced metallic materials primarily composed of low‐activation elements, offering advantages such as rapid compliance with operational standards and safe recyclability. This review highlights their potential for extreme high‐temperature irradiation environments as structural materials for ...
Yangfan Wang   +8 more
wiley   +1 more source

Hybrid Framework Materials: Next‐Generation Engineering Materials

open access: yesAdvanced Engineering Materials, Volume 27, Issue 9, May 2025.
Hybrid organic–inorganic materials merge the unique properties of organic and inorganic compounds, enabling applications in optoelectronics, gas storage, and catalysis. This review explores metal‐organic frameworks, hybrid organic–inorganic perovskites, and the emerging field of hybrid glasses, emphasizing their structures, functionalities, and ...
Jay McCarron   +2 more
wiley   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

Advances in Computational Social Science [PDF]

open access: green, 2014
Shu‐Heng Chen   +3 more
openalex   +1 more source

Plasma‐Induced Maskless Formation of Quasi‐Periodic Nanoripples on Polymeric Substrates

open access: yesAdvanced Engineering Materials, Volume 27, Issue 7, April 2025.
Reactive plasma etching is proposed for maskless, rapid, mass‐production of quasi‐periodic nanoripples formed on the area adjacent to the electrode of polymeric substrates perpendicularly placed on the electrode. To this end, a modeling framework is employed for the calculation of particle trajectories, which predicts the angular and energy ...
Athina S. Kastania   +9 more
wiley   +1 more source

Impacts of Device Geometry and Layout on Temperature Profile during Large‐Area Photonic Curing

open access: yesAdvanced Engineering Materials, EarlyView.
The study investigates how gate geometry affects peak curing temperature during photonic curing of solution‐processed indium zinc oxide thin‐film transistors. Using 3D simulations and experimental validation, it reveals that larger gate areas and smaller aspect ratios increase curing temperature and thus improve transistor performance. Findings provide
Yasir Fatha Abed   +3 more
wiley   +1 more source

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