Results 221 to 230 of about 92,114 (300)
Thermal-electrical multiphysics modeling of ZnO/mesoporous carbon nanocomposite anodes for lithium-ion batteries. [PDF]
Abushuhel M +7 more
europepmc +1 more source
A protocol of fs‐laser‐induced periodic phase‐transition of 2D‐MoTe2 template, inducing AuNPs@1T’‐MoTe2 nanograting, is developed. The labeled AuNPs@1T’‐MoTe2 substrate conjugated with specialized immunoglobulin G demonstrates an unexpectedly high discrimination accuracy close to unity for serological diagnosis of rheumatoid arthritis by frequency ...
Yao Yao +9 more
wiley +1 more source
Thermal Conductivity above 2,000 W/m·K in Boron Arsenide by Nanosecond Transducer-Less Time-Domain Thermoreflectance. [PDF]
Zhong H +10 more
europepmc +1 more source
A multifunctional benzimidazole‐terminated CNF separator is constructed via a PEI‐mediated covalent locking strategy, generating dense zincophilic sites that accelerate Zn2+ transport and desolvation while enabling uniform Zn (002) deposition and suppressing side reactions.
Jie Liang +17 more
wiley +1 more source
Enhancing Microparticle Separation Efficiency in Acoustofluidic Chips via Machine Learning and Numerical Modeling. [PDF]
Klymkovych T +3 more
europepmc +1 more source
Hierarchical PP–LSR107–BaTiO3 nanocomposite films are fabricated by one‐step extrusion and stretching for roll‐to‐roll manufacture, combining high energy storage and processing flexibility. LSR107 surrounds BaTiO3‐rich regions, locating amorphous PP, decreasing defects, and introducing deep traps that homogenize the electric field and suppress charge ...
Yi Gao +14 more
wiley +1 more source
Design of aerogel granule size for thermal insulation of petroleum pipelines. [PDF]
Liu X +8 more
europepmc +1 more source
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen +7 more
wiley +1 more source
High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning. [PDF]
Chen X +5 more
europepmc +1 more source

