On the rise of conic sections from circular sheafs and some from it following theorems [PDF]
Antonín Pleskot
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This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue +6 more
wiley +1 more source
Semi-supervised semantic segmentation of cell nuclei with diffusion model and collaborative learning. [PDF]
Shao Z, Sengupta S, Anastasio MA, Li H.
europepmc +1 more source
The versal deformation of small resolutions of conic bundles over P1×P1 with two sections blown down
Bernd Kreussler, Jan Stevens
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Recent Advances of Slip Sensors for Smart Robotics
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang +8 more
wiley +1 more source
A Novel Method for Analysing the Curvature of the Anterior Lens: Multi-Radial Scheimpflug Imaging and Custom Conic Fitting Algorithm. [PDF]
Arcas-Carbonell M +4 more
europepmc +1 more source
Tunable 3D‐Printed Static Mixers for Gradient Bioprinting With High Cell Viability
ABSTRACT The fabrication of native tissue‐like structures with gradual transitions in material properties, cell types, and growth factors remains a major challenge in biofabrication due to the lack of suitable methods. Mimicking the hierarchical organization of living tissues is essential for functional models, yet creating gradient, multimaterial ...
Florian Hofmann +9 more
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Evolution of Human Scar-Related Ventricular Tachycardia Mapping for Exploring Mechanisms of Reentry Circuits. [PDF]
Nishimura T, Tung R.
europepmc +1 more source
Molecular Inks for the Development of Complex 3D In‐Mold Electronics
Molecular inks (MINKs) enable the fabrication of thermoformed 3D circuits by decoupling the forming and metallization steps. Following thermoforming, intense pulsed‑light or thermal processing converts the patterned MINKs into complex 3D conductive tracks with improved stretchability and electrical performance, advancing low‑cost, high‑performance in ...
Mehal P. Kushalkar +14 more
wiley +1 more source

