Results 191 to 200 of about 59,062 (321)

Characterization and Design Framework for Micro‐ and Nanoscale Printed Metal Interconnects in Hybrid Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue   +6 more
wiley   +1 more source

Recent Advances of Slip Sensors for Smart Robotics

open access: yesAdvanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang   +8 more
wiley   +1 more source

A Novel Method for Analysing the Curvature of the Anterior Lens: Multi-Radial Scheimpflug Imaging and Custom Conic Fitting Algorithm. [PDF]

open access: yesJ Imaging
Arcas-Carbonell M   +4 more
europepmc   +1 more source

Tunable 3D‐Printed Static Mixers for Gradient Bioprinting With High Cell Viability

open access: yesAdvanced Materials Technologies, EarlyView.
ABSTRACT The fabrication of native tissue‐like structures with gradual transitions in material properties, cell types, and growth factors remains a major challenge in biofabrication due to the lack of suitable methods. Mimicking the hierarchical organization of living tissues is essential for functional models, yet creating gradient, multimaterial ...
Florian Hofmann   +9 more
wiley   +1 more source

Molecular Inks for the Development of Complex 3D In‐Mold Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
Molecular inks (MINKs) enable the fabrication of thermoformed 3D circuits by decoupling the forming and metallization steps. Following thermoforming, intense pulsed‑light or thermal processing converts the patterned MINKs into complex 3D conductive tracks with improved stretchability and electrical performance, advancing low‑cost, high‑performance in ...
Mehal P. Kushalkar   +14 more
wiley   +1 more source

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