Results 111 to 120 of about 558,879 (285)

Novel Surface‐Based Bézier Metamaterials: A Higher Degree of Parametrization toward Tailoring the Effective Properties under Compression

Advanced Engineering Materials, EarlyView.
Cubic Bézier curves are used in the synthesis of novel surface‐based metamaterials with tunable mechanical properties. Surface‐based geometries are 3D printed and tested in compression. The resulting mechanical properties are correlated to changes in the shape of the base curve, with high potential in energy absorption through the adjustment of their ...
Alberto Álvarez‐Trejo, Enrique Cuan‐Urquizo, Armando Roman‐Flores   +2 more
wiley   +1 more source

Effect of Copper Content on the Microstructure and Mechanical Properties of As‐Cast Refractory MoNbTi Multiprincipal Element Alloys

Advanced Engineering Materials, EarlyView.
Copper addition profoundly impacts MoNbTi multiprincipal element alloys. This study reveals copper's dual role, promoting microstructural refinement and strengthening intermetallics at optimal concentrations. An ideal copper content significantly boosts hardness and compressive strength, achieving superior mechanical performance.
Eder Lopes Ortiz, João Felipe Queiroz Rodrigues, Renato Baldan, Erik Poloni, Giovana da Silva Padilha, Wislei Riuper Osório, Ausdinir Danilo Bortolozo   +6 more
wiley   +1 more source

Microscale 3D Printed Pillars and Porous Polymeric Structures: Manufacturability and Micromechanics

Advanced Engineering Materials, EarlyView.
This work demonstrates how two‐photon polymerization enables the fabrication of microscale solid and porous structures from IP‐Q, IP‐S, and IP‐PDMS resins. Combining morphological and mechanical characterization, the study provides the first systematic insights into IP‐Q mechanics and reveals how processing parameters affect structure and stiffness ...
Aikaterini Isaakidou, Mahya Ganjian, Vahid Moosabeiki, Marius Alexander Leeflang, Mahdiyeh Nouri Goushki, Pouyan Esmailzadeh Boukany, Maria Wątroba, Alexander Groetsch, Jakob Schwiedrzik, Mohammad Javad Mirzaali, Iulian Apachitei, Lidy Elena Fratila‐Apachitei, Amir Abbas Zadpoor   +12 more
wiley   +1 more source

Design of Multiphase Compositionally Complex Alloys for Enhanced Hardness at Elevated Temperatures and Machinability: Comparative Study with Inconel 718

Advanced Engineering Materials, EarlyView.
This study compares the mechanical properties of Inconel 718 with two newly developed compositionally complex alloys (CCAs). Inco‐like‐H alloy demonstrates significantly improved wear resistance, surface finish, and hardness, notably at high temperatures. This CCA requires no heat treatment and is well suited for additive manufacturing. Its performance
Laurent Peltier, Gaël Le Coz, Fodil Meraghni, Jérome Slowensky   +3 more
wiley   +1 more source

Micromechanical Insights into Sinter‐Based Additively Manufactured NiTi with Nb as a Sintering Aid

Advanced Engineering Materials, EarlyView.
This study investigates the microstructural and micromechanical behavior of NiTiNb made through filament‐based materials extrusion via chemically correlated nanoindentation. B19' remnants from the original powder lead to Nb gradients within NiTiNb grains due to the short sintering times required in liquid‐phase sintering.
Nerea Abando, Rebecca A. Gallivan, Nensi Toncich, Arnold Müller, Ralph Spolenak   +4 more
wiley   +1 more source

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

Advanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García, Nekane Lozano‐Hernandez, Maria Lluisa Maspoch, Enric Fontdecaba   +3 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source

Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli

Advanced Engineering Materials, EarlyView.
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley   +1 more source

Research on group type theory and its functorial semantic models in category logic. [PDF]

PLoS One
Tang JG, Aishan Y, Liu JY, Peng JY.
europepmc   +1 more source

Additive Manufacturing of Gradient Stiffness Honeycombs Using Thermoplastic Polyurethane Composite Material Variations

Advanced Engineering Materials, EarlyView.
By combining porous, solid, and carbon fiber‐reinforced thermoplastic polyurethane within a single 3D printed honeycomb structure, this current work achieved precise control over spatial stiffness while ensuring strong interlayer adhesion. The findings demonstrate enhanced energy absorption and densification strain, outperforming traditional uniform ...
Savvas Koltsakidis, Konstantinos Tsongas, Dimitrios Tzetzis   +2 more
wiley   +1 more source