Results 241 to 250 of about 835,238 (391)

Double‐Stranded DNA Reduces dsRNA Degradation in the Saliva and Significantly Enhanced RNAi‐Mediated Gene Silencing in Halyomorpha halys

open access: yesAdvanced Biology, EarlyView.
The invasive pest Halyomorpha halys causes significant crop losses requiring innovative pest control strategies such as RNA interference (RNAi). However, oral RNAi is largely ineffective in H. halys. This study shows that double‐stranded DNA (dsDNA) stabilizes dsRNA in saliva by inhibiting a highly expressed nuclease.
Venkata Partha Sarathi Amineni   +2 more
wiley   +1 more source

Microphysiological Glomerular Filtration Barriers: Current Insights, Innovations, and Future Applications

open access: yesAdvanced Biology, EarlyView.
The glomerular filtration barrier (GFB) is the first step of blood filtration by the kidneys. The concerning increase of kidney diseases makes the development of new models essential. In this context, microphysiological glomerular filtration barriers focus on closely reproducing the physiological architecture of the in vivo GFB: podocytes, glomerular ...
Manon Miran   +5 more
wiley   +1 more source

Intersection Between Local Anesthetics and Cancer Biology: What Now? Where Are We Going?

open access: yesAdvanced Biology, EarlyView.
Local anesthetics (LAs), widely used in anesthesia, may also play a role in cancer treatment by inhibiting tumor growth, reducing metastasis, and enhancing immune responses. They modulate key pathways like AKT/mTOR and RAS/ERK while affecting angiogenesis and tumor innervation and the immune response.
Eduardo Nunez‐Rodriguez   +3 more
wiley   +1 more source

Incremental payments for consultants [PDF]

open access: green, 1976
N. Jones   +17 more
openalex   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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