Results 241 to 250 of about 909,230 (341)

Investigating the Structural Factors Influencing the Magnetic Interaction between Individual Copper Spins in the CuCu4 Metallacrown Complex, from Its Bulk Form to Its Adsorption on Au(111)

open access: yesAdvanced Materials Interfaces, EarlyView.
The Cu(II)[12‐MCCu(II)N(Shi)‐4] metallacrown complex (CuCu4) is studied to examine how geometric transformations affect magnetic coupling between copper spins by using ultraviolet photoemission spectroscopy and DFT calculations for the bulk phase and CuCu4 adsorbed on Au(111). While adsorption minimally affects tDOS, exchange coupling constants between
Ariyan Tavakoli   +11 more
wiley   +1 more source

Transparent, Sprayable Plastic Films for Luminescent Down‐Shifted‐Assisted Plant Growth

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Spreading the light: A modular approach to down‐shifting europium‐containing polyoxotitanium luminescent cages is developed, allowing their incorporation into sprayable plastic coatings on agricultural greenhouses for accelerated plant growth. Abstract The world's steadily growing population and global heating due to climate change are a threat to food
Rosa Müller   +17 more
wiley   +1 more source

A Microfluidic Multiplex Sorter for Strain Development

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves   +6 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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