Results 221 to 230 of about 2,931,024 (350)
Study on Vibration Compaction Behavior of Fresh Concrete Mixture with Ternary Aggregate Grading. [PDF]
He L, Li F, Qu H, Tian Z, Shen W, Luo C.
europepmc +1 more source
A Microfluidic Multiplex Sorter for Strain Development
A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves +6 more
wiley +1 more source
Network-based proactive contact tracing: A pre-emptive, degree-based alerting framework for privacy-preserving COVID-19 apps. [PDF]
Diallo D, Hecking T.
europepmc +1 more source
Contact and near-contact binary systems - V. RV Corvi [PDF]
T. M. McFarlane +2 more
openaire +1 more source
The given research presents an innovative insole‐based device employing self‐powered triboelectric nanogenerators (TENG) for flatfoot detection. By integrating TENG tactile sensors within an insole, the device converts mechanical energy from foot movements to electrical signals analyzed via machine learning, achieving an 82% accuracy rate in flatfoot ...
Moldir Issabek +7 more
wiley +1 more source
A curated global dataset of social contact between diverse language communities. [PDF]
Kashima E +49 more
europepmc +1 more source
The early type contact binary system V 382 Cygni [PDF]
Ö. L. Değirmenci +6 more
openalex +1 more source
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Multiple moonlet mergers as the origin of the Dinkinesh-Selam system. [PDF]
Raducan SD +9 more
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source

