Results 111 to 120 of about 4,440,599 (246)
In resistance spot welding (RSW), the total electrical resistance (dynamic resistance) as the sum of bulk and contact resistance is a key variable.
Andreas Fezer, Stefan Weihe, Martin Werz
doaj +1 more source
Low‐temperature imidization of PEG‐modified polyimide enables fully screen‐printed, roll‐to‐roll fabrication of flexible electrodes on PET substrates, delivering robust mechanical durability and reliable ECG/EMG signal performance for wearable electronics.
Akib Abdullah Khan, Jong‐Hoon Kim
wiley +1 more source
Readily Tunable Surface Potential by Functionalizing Pentacene with Dipole Monolayers
The surface potential of a prototypical organic semiconductor, pentacene, is chemically modified by the addition of a dipole monolayer on top of the thin film. Changes are afforded by reacting the topmost layer of pentacene to generate the monolayer, and
Matthew C. Williams +4 more
doaj +1 more source
Investigation on the Thermal Characteristics of 33-kV DC Vacuum Circuit Breakers Using 3-D Modeling
In this article, a 3D model is used to investigate the thermal performance of the 33 kV Direct Current Vacuum Circuit Breakers (DCVCBs) when operating under normal current as well as under faulty conditions.
Ossama E. Gouda +3 more
doaj +1 more source
A simplified thermoplastic pultrusion model is developed to predict thermal fields in glass fiber/polyethylene terephthalate (GF/PET) composites with reduced computational cost. By combining effective material homogenization, validation against literature data, and Gaussian‐process‐based optimization, the study reveals how heating limits, pulling speed,
Elder Soares +3 more
wiley +1 more source
Current Status and Challenges in Data Collection for Aerospace Coatings Deposited by Plasma Spraying
An innovative approach has been integrated into the GRENAT project to optimize plasma spraying and coating performance. Raw materials are accelerated and melted in the plasma generated by torches, creating coatings. Monitoring sensors collect process data which are combined with ex situ characterization data.
Lila Randriamananjara +8 more
wiley +1 more source
Strong Collective Responses in Quasi-1D Metadevices for Millimeter-Wave Electronics
Quasi-1D electronic metadevices, which utilize periodic arrays of subwavelength metallic structures to enhance high-frequency electrical performance, have shown promise for ultrafast integrated electronics.
Abdallah Abushawish +2 more
doaj +1 more source
Modular Critical Element Recycling Platform Using a Nanoporous Additively Manufactured Gyroid
A modular recycling platform integrates 3D‐printed nanoporous gyroid structures to enable efficient critical element recovery. This system utilizes a hierarchical architecture, combining macroscopic channels with polymerization‐induced nanoscale porosity. By systematically tuning structural wall thickness and resin formulation, the platform achieves an
Xiangyu Gao +6 more
wiley +1 more source
High‐Performance Monolayer 1T‐GeO2 Transistors with Low‐Resistance Metal Contacts
As silicon‐based electronics approach their scaling limits in the post‐Moore era, 2D semiconductors offer a promising path forward. In this study, first‐principles calculations are employed, combined with quantum transport simulations to predict that ...
Shuai Lang +6 more
doaj +1 more source
Post-Release Metallization in MEMS Silicon-to-Silicon Contact Switches for On-Resistance Improvement
This work reports a post-release sputter-metallization process for microelectromechanical systems (MEMS) switches with silicon-to-silicon (Si-to-Si) contacts fabricated by deep reactive ion etching.
Abdurrashid Hassan Shuaibu +3 more
doaj +1 more source

