Results 141 to 150 of about 1,210,014 (249)

Valence and Site Engineering Enable Efficient Broadband Near‐Infrared Emission at 960 nm in Cr3+‐Activated Forsterite

Advanced Materials, EarlyView.
This study reports a near‐infrared (NIR) luminescent material (Mg2SiO4:1.5%Cr,5%Li) with efficient (EQE = 48%) ultra‐broadband (FWHM ≈ 2413 cm−1 (226 nm)) NIR emission at 960 nm upon blue‐light excitation. This innovation addresses the low efficiency of long‐wavelength (λmax > 900 nm) NIR‐emitting materials due to the radiationless de‐activation and ...
Lei Zhong, Yuefei Xiang, Shiwen Liu, Zaidong Chen, Qingyu Kong, Zhaowen Bai, Yang Ren, Fangxi Xie, Chunyan Jiang, Lei Zhou, Jean‐Claude G. Bünzli, Mingmei Wu   +11 more
wiley   +1 more source

Tuning the Morphological Properties of Granular Hydrogels to Control Lymphatic Capillary Formation

Advanced Materials Interfaces, EarlyView.
Tuning the morphological properties of granular hydrogels is essential to generate robust lymphatic capillary networks that express key lymphatic gene and protein markers. The study demonstrates that 3D in vitro lymphatic tube formation is controlled not by the mechanical properties of the gel, but by the pore size and topology (periodicity) of the gel
Daniel Montes, Sanjoy Saha, Angela Taglione, Donghyun Paul Jeong, Liao Chen, Fei Fan, Hsueh‐Chia Chang, Donny Hanjaya‐Putra   +7 more
wiley   +1 more source

Increased brightness assimilation in rod vision

iScience
Summary: Our visual system uses contextual cues to estimate the brightness of surfaces: brightness can shift toward (assimilation) or away from (contrast) the brightness of the surroundings.
Pablo A. Barrionuevo, Alexander C. Schütz, Karl R. Gegenfurtner   +2 more
doaj  

Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction

Advanced Materials Interfaces, EarlyView.
In this work, wide‐field (>1 mm2) frequency‐domain thermoreflectance (FDTR) hyperspectral imaging is used to image subsurface indium bump bonds 50 µm below the surface. Thermal analysis with Monte Carlo uncertainty propagation is used to evaluate bump quality, while a trained deep neural network (can rapidly reconstruct bump geometry contact area maps.
Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew Jordan, Anthony McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason Neely, Luke Yates   +10 more
wiley   +1 more source

Structural Evolution During Repeated Spray Deposition of FeCl₃‐Doped Poly(Styrene)‐b‐Poly(4‐Vinyl Pyridine) Layers

Advanced Materials Interfaces, EarlyView.
The structure formation mechanism of pure poly(styrene)‐b‐poly(4‐vinyl pyridine) (PS‐b‐P4VP) and hybrid PS‐b‐P4VP/FeCl₃ films during and after spray deposition is investigated. The morphological differences result from the interplay among the complexation between FeCl₃ and P4VP segments, the crystallization of the P4VP segment, and the surface ...
Shanshan Yin, Wei Cao, Suo Tu, Suzhe Liang, Yuqin Zou, Ting Tian, Guangjiu Pan, Zhuijun Xu, Lixing Li, Lyuyang Cheng, Ya‐Jun Cheng, Matthias Schwartzkopf, Stephan V. Roth, Liangjun Zhai, Peter Müller‐Buschbaum   +14 more
wiley   +1 more source

Photoactive Monolayer MoS2 for Spiking Neural Networks Enabled Machine Vision Applications

Advanced Materials Technologies, EarlyView.
Molybdenum disulfide (MoS2) optoelectronic devices are implemented as Leaky Integrate‐and‐Fire (LIF) neurons in spiking neural networks (SNNs), where light‐induced photocurrent dynamics represent potentiation (τd) and depression (τd), emulating neuronal membrane potential.
Thiha Aung, Sindhu Priya Giridhar, Irfan H. Abidi, Taimur Ahmed, Akram AI‐Hourani, Sumeet Walia   +5 more
wiley   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

Advanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn, Hongyun So   +4 more
wiley   +1 more source

Visible and Infrared Dual‐Band Camouflage Device Using Reflective Display Technology

Advanced Materials Technologies, EarlyView.
Integrating electrochromic devices and electrophoretic display technologies has led to developing a flexible dual‐band camouflage device. The system enables adaptive modulation across visible and near‐infrared spectra through pixel‐level control, rapid switching, and bistable operation.
Ju Hyun Park, Yongjun Lee, Jiyoung Oh, Sanghoon Cheon, Byeong‐Kwon Ju, Jisu Han, Chil Seong Ah, Tae‐Youb Kim   +7 more
wiley   +1 more source

The Nanosprouts Structural Inhomogeneity of Organic Semiconductors and the Optical Memory Properties

Advanced Materials Technologies, EarlyView.
A flexible nonvolatile organic optical memory transistor (OMT) array is demonstrated with simplified architecture, exhibiting integrated image recognition and storage functions. The organic semiconductors exhibit intrinsic memory properties arising from structural inhomogeneity.
Lizhi Yan, Deng Zou, Yuyang Yin, Yifan Guo, Ming Chen, Xing Cheng, Paddy Kwok Leung Chan   +6 more
wiley   +1 more source

Durable Anti‐fogging Polymer Coatings Based on C,H Insertion Cross–linking (CHic) That Are User and Environmentally Friendly

Advanced Materials Technologies, EarlyView.
Highly photoreactive polymer networks prevent fogging by forming uniform water films. Activated by visible light and cross‐linked by CH insertion, these coatings exhibit excellent water film formation, transparency, and durability, even after frequent washing.
Alexander Bleiziffer, Florian Deussen, Jürgen Rühe   +2 more
wiley   +1 more source