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A Converter-Level Junction Temperature Monitoring Method for IGBT Based on the Turn-OFF Gate Electric Quantities

IEEE Transactions on Power Electronics
Kexin Yang   +6 more
openaire   +1 more source

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level—Part 1

IEEE Transactions on Components, Packaging and Manufacturing Technology
Przemyslaw Gromala   +2 more
openaire   +1 more source

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2

IEEE Transactions on Components, Packaging and Manufacturing Technology
Przemyslaw Gromala   +2 more
openaire   +1 more source

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