Results 131 to 140 of about 22,170,122 (349)
A selection principle with applications in convex analysis and optimization
, 1988 Dominik Noll
openalex +1 more source
Stable distributions and harmonic analysis on convex cones [PDF]
, 2007 Youri Davydov +2 more
openalex +1 more source
Pick‐and‐Place Grippers with Tunable Adhesion from Capped Soft Hollow Pillar Structure
Advanced Materials Technologies, EarlyView.Mushroom‐shaped soft hollow pillars (SHPs) with a mushroom cap, or capped SHPs (C‐SHPs) are introduced for improved tunable adhesion under pneumatic actuation. The mushroom cap optimizes stress distribution and alters crack initiation on the contact interface, leading to significantly improved adhesion strength and tunability.
Yanbing Tang +3 more
wiley +1 more source
NON-PROBABILISTIC RELIABILITY SENSITIVITY ANALYSIS BASED ON CONVEX MODEL
Jixie qiangdu, 2019 Reliability sensitivity determines the relationship between reliability and the distribution parameters of uncertain variables, and guides reliability analysis and reliability design.
QIAO XinZhou +3 more
doaj
Differential Sensitivity Analysis for Convex Programming Problem
, 1987 Yo Ishizuka
openalex +2 more sources
A Two-Sided Discrete-Concave Market with Possibly Bounded Side Payments: An Approach by Discrete Convex Analysis [PDF]
, 2007 Satoru Fujishige, Akihisa Tamura
openalex +1 more source
How to Manufacture Photonic Metamaterials
Advanced Materials Technologies, EarlyView.Metamaterials boast applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, but these applications haven’t been exploited in earnest and the market for them hasn’t grown much likely because facile and economical methods for fabricating them without defect has not emerged.
Apurba Paul, Gregory Timp
wiley +1 more source
Compliant Die Attach Process for High‐Conformity Integration of Ultra‐Thin Chips on Curved Surfaces
Advanced Materials Technologies, EarlyView.A compliant die attach process is developed for bonding ultra‐thin silicon dies onto high‐curvature surfaces. Using FEM‐guided tool design and process optimization, the method achieves excellent surface conformity and minimal voids. This approach offers a reliable solution for next‐generation curved electronics, including LiDAR and wide field‐of‐view ...
Hakyung Jeong +9 more
wiley +1 more source
Hybrid symbolic‐numeric algorithms for computational convex analysis [PDF]
, 2007 Yves Lucet
openalex +1 more source