Results 71 to 80 of about 603,865 (279)

Investigation on Regularities of Self‐Healing Breakdown in Metallized Film Capacitors for AC Application

open access: yesAdvanced Materials Interfaces, EarlyView.
Self‐healing capacitors, with advantages of high operating voltage, great energy density, and environmental friendliness, are widely used in power system. The electrodes of the capacitors consist of a nanometer‐thick metal layer on polypropylene films, granting them a unique self‐healing capability.
Fei Yan   +4 more
wiley   +1 more source

Cephalometrically analysis of the convexity angle

open access: yesStomatoloski glasnik Srbije, 2003
The convexity angle of facial bone structures ( N-A: A-Pg) expresses the sagittal protrusion of the maxillary part of the face compared to facial profile (the convex or concave face).The convexity angle is defined as the angle colligated by the lines N-A and A-Pg.
openaire   +4 more sources

Multi‐Material Gradient Printing Using Meniscus‐enabled Projection Stereolithography (MAPS)

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
MAPS is a new vat‐free printing technique that utilizes programmed delivery of resin droplets with custom formulations to enable multi‐material gradient printing of 3D structures with user‐defined variations in mechanical stiffness, opacity, surface energy, cell densities, and magnetic properties. Abstract Light‐based additive manufacturing methods are
Puskal Kunwar   +10 more
wiley   +1 more source

4D Bioprinted Self‐Folding Scaffolds Enhance Cartilage Formation in the Engineering of Trachea

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A bilayer self‐folding scaffold, triggerable by humidity, is fabricated via 4D bioprinting for trachea engineering. An analytical model is derived to predict its radius of curvature, enabling its scalability. Cartilage progenitor cells seeded on the scaffold perceive scaffold final curvature and react to it, by enhancing the upregulation of pro ...
Irene Chiesa   +4 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

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