Results 71 to 80 of about 603,865 (279)
Convex Analysis and Nonlinear Optimization: Theory and Examples. Jonathan M. Borwein and Adrian S. Lewis, Springer, New York, 2000 [PDF]
Michael J. Todd
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Self‐healing capacitors, with advantages of high operating voltage, great energy density, and environmental friendliness, are widely used in power system. The electrodes of the capacitors consist of a nanometer‐thick metal layer on polypropylene films, granting them a unique self‐healing capability.
Fei Yan+4 more
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Cephalometrically analysis of the convexity angle
The convexity angle of facial bone structures ( N-A: A-Pg) expresses the sagittal protrusion of the maxillary part of the face compared to facial profile (the convex or concave face).The convexity angle is defined as the angle colligated by the lines N-A and A-Pg.
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Multi‐Material Gradient Printing Using Meniscus‐enabled Projection Stereolithography (MAPS)
MAPS is a new vat‐free printing technique that utilizes programmed delivery of resin droplets with custom formulations to enable multi‐material gradient printing of 3D structures with user‐defined variations in mechanical stiffness, opacity, surface energy, cell densities, and magnetic properties. Abstract Light‐based additive manufacturing methods are
Puskal Kunwar+10 more
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The free energy of mixing for n-variant martensitic phase transformations using quasi-convex analysis [PDF]
Sanjay Govindjee+2 more
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4D Bioprinted Self‐Folding Scaffolds Enhance Cartilage Formation in the Engineering of Trachea
A bilayer self‐folding scaffold, triggerable by humidity, is fabricated via 4D bioprinting for trachea engineering. An analytical model is derived to predict its radius of curvature, enabling its scalability. Cartilage progenitor cells seeded on the scaffold perceive scaffold final curvature and react to it, by enhancing the upregulation of pro ...
Irene Chiesa+4 more
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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya+3 more
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FOURIER ANALYSIS ON LOCALLY CONVEX SPACES OF DISTRIBUTIONS, II [PDF]
R. P. Sinha, A. N. Mohammed
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Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
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