Results 81 to 90 of about 603,865 (279)

Pick‐and‐Place Grippers with Tunable Adhesion from Capped Soft Hollow Pillar Structure

open access: yesAdvanced Materials Technologies, EarlyView.
Mushroom‐shaped soft hollow pillars (SHPs) with a mushroom cap, or capped SHPs (C‐SHPs) are introduced for improved tunable adhesion under pneumatic actuation. The mushroom cap optimizes stress distribution and alters crack initiation on the contact interface, leading to significantly improved adhesion strength and tunability.
Yanbing Tang   +3 more
wiley   +1 more source

Convex Analysis in Quantum Information

open access: yes, 2017
Convexity arises naturally in the study of quantum information. As a result, many useful tools from convex analysis can be used to give important results regarding aspects of quantum information. This thesis builds up methods using core concepts from convex analysis, including convex optimization problems, convex roof constructions, and conic ...
openaire   +3 more sources

How to Manufacture Photonic Metamaterials

open access: yesAdvanced Materials Technologies, EarlyView.
Metamaterials boast applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, but these applications haven’t been exploited in earnest and the market for them hasn’t grown much likely because facile and economical methods for fabricating them without defect has not emerged.
Apurba Paul, Gregory Timp
wiley   +1 more source

Biomechanical Performance of Additively Manufactured Bone‐Mimicking Scaffolds with Graded Architectures

open access: yesAdvanced Materials Technologies, EarlyView.
Nozzle temperature of 180 °C suits well for supportless PLA stochastic scaffolds. The scaffolds exhibit higher strength and stiffness under sudden impact loading. Grading type shows significant influence on scaffold properties. Radial descending type performs best in both mechanical and permeability aspects. Graded stochastic scaffolds are suitable for
Kaushik Raj Pyla   +2 more
wiley   +1 more source

Compliant Die Attach Process for High‐Conformity Integration of Ultra‐Thin Chips on Curved Surfaces

open access: yesAdvanced Materials Technologies, EarlyView.
A compliant die attach process is developed for bonding ultra‐thin silicon dies onto high‐curvature surfaces. Using FEM‐guided tool design and process optimization, the method achieves excellent surface conformity and minimal voids. This approach offers a reliable solution for next‐generation curved electronics, including LiDAR and wide field‐of‐view ...
Hakyung Jeong   +9 more
wiley   +1 more source

Stable distributions and harmonic analysis on convex cones [PDF]

open access: hybrid, 2007
Youri Davydov   +2 more
openalex   +1 more source

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